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High power LED

A light-emitting diode, high-power technology, applied in electrical components, electric solid-state devices, circuits, etc., can solve the problems of large thermal resistance, small metal base area, overheating of light-emitting diodes, etc. handy effect

Inactive Publication Date: 2004-11-10
浙江城建建设集团有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The area of ​​the metal base is small, for example, less than 6mm in diameter, and the thermal conductivity of aluminum is only about 1 / 2.5 of that of copper. The copper heat conduction adhesive layer has a large thermal resistance, and the temperature of the chip is easy to rise; at the same time, it is easy to cause the heat conduction adhesive to crack after working for a long time, which greatly increases the heat resistance, and causes the LED to overheat and burn out

Method used

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Embodiment Construction

[0024] The present invention mainly includes at least one light-emitting diode chip, and the light-reflecting metal electrode on the outer surface of the p-n junction of the chip is pasted on a silicon substrate with a higher thermal conductivity than a silicon substrate through self-localized solder mixed with small silver beads or small gold beads. On the diamond substrate; the self-localized solder mixed with small silver beads or small gold beads is adsorbed by small silver beads or small gold beads when the solder melts and will not flow away to cause electrode short circuit, that is, it can be soldered without a dielectric layer Self-localized, while its thickness can be controlled by the diameter of small silver beads or small gold beads, its thickness can be very thin, such as less than 0.04mm, and the contact area with the chip can be very large, such as greater than 30% of the chip area; the diamond substrate The side facing the chip has a solderable circuit conductiv...

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Abstract

The invention is a high-power light-emitting diode (LED), at least including a LED chip, optical refection metallic electrodes on the outer surface of the p-n junction are directly mounted on a metallic base through high thermal conductivity material or diamond whose thermal conductivity is thrice higher than that of Cu, where the high thermal conductivity material can be small-Ag / Au pearl mixed soldering tin, diamond thermal conducting glue or Ag pearl / powder mixed thermal conducting glue; the electrodes are led out from the conductive layer or circuit board of a diamond basal plate, and the metallic base has at least one screw or screw hole used in connection with cooler; the chip and metallic base have transmitting mediums and lenses, and lighting material also, and the chip can be used for making LED lamps, solar energy LED lamps, LCD back lighting, information display, etc.

Description

technical field [0001] The invention relates to a light-emitting diode, especially a high-power, high-efficiency, long-life light-emitting diode, which is used for lighting, traffic lights and information display. Background technique [0002] The chips of high-power light-emitting diodes will generate a lot of heat when they work, so that the temperature of the chips will rise rapidly, and the luminous efficiency of the light-emitting diode chips will almost plummet with the rise of the chip temperature. How to minimize the thermal resistance of light-emitting diodes, effectively conduct and dissipate the heat generated by the chip, and make the light-emitting diode chip work at a lower temperature is the key to the manufacture of high-power light-emitting diodes and their applications. [0003] The high-power light-emitting diodes and chips in the prior art are installed on a silicon substrate, and are connected with solder. The thermal conductivity of the solder is only 1...

Claims

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Application Information

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IPC IPC(8): H01L33/00
CPCH01L2224/1403H01L2224/16225H01L2924/19107
Inventor 葛世潮
Owner 浙江城建建设集团有限公司
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