Electroplating compositions and methods

A composition and alloy technology, applied in electrophoretic plating, circuit, electrolytic coating, etc., can solve the problems of precise control of difficult alloy concentration, long processing time, etc.

Inactive Publication Date: 2005-01-26
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method generally requires considerable processing time, and it is difficult to precisely control the alloy concentration

Method used

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  • Electroplating compositions and methods
  • Electroplating compositions and methods
  • Electroplating compositions and methods

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-3

[0070] The electrolyte composition was prepared by mixing 60 g / L tin from tin methanesulfonate, 1.5 g / L silver from silver methanesulfonate, 50 g / L methanesulfonic acid, 15 g / L 1-ene Propyl-2-thiourea, 1.04g / L vanadium (IV) acetylacetonate, content of 5, 10 and 15g / L tetrakis (2-hydroxypropyl) ethylenediamine and the balance of deionized water mixed . Immerse the specimen of Hull steel plate into the composition of Hull tank, using 2, 4, 6, 8A / dm respectively 2 The current density is plated with a layer of tin-silver. The concentration of silver in the resulting layer on each sample was determined using XRF. Measurement results such as figure 2 as shown, figure 2 is the relationship between sediment composition and current density. figure 2 It is shown that, in a wide range of current densities, tin-silver deposits can obtain a uniform composition.

Embodiment 4-5

[0071] Embodiment 4-5, comparative example 1

[0072] The electrolyte composition was prepared by adding 40 g / L tin from tin methanesulfonate, 1 g / L silver from silver methanesulfonate, 90 g / L methanesulfonic acid, 2 g / L ethoxy Mix phenol, 4g / L 1-allyl-2-thiourea and the rest of deionized water. Hull steel plates are coated with tin-silver in a composition dipped in a Hull bath. The current densities on the steel plate were determined to be 2, 4, 6, 8 and 10A / dm by XRF 2 The concentration of silver in the resulting layer at the corresponding position of . Respectively replace 1-allyl-2-thiourea with 1,1,3,3-tetramethyl-2-thiourea and 4g / L thiourea (comparative example), to the electrolyte obtained Composition Repeat the above steps. Measurement results such as image 3 as shown, image 3 is the relationship between the composition of the deposit and the current density of the three electrolyte compositions.

[0073] From image 3 It can be seen that at a current dens...

Embodiment 6

[0074] Embodiment 6, comparative example 2

[0075] The electrolyte composition was prepared by adding 40 g / L tin from tin methanesulfonate, 1 g / L copper from copper methanesulfonate, 90 g / L methanesulfonic acid, 2 g / L ethoxy Mix bisphenol, 4g / L 1-allyl-2-thiourea and the rest of deionized water. Hull steel plates were dipped into the composition in a Hull tank and coated with a layer of tin-copper. The current densities on the steel plate were determined to be 2, 4, 6, 8 and 10A / dm by XRF 2 The concentration of copper in the resulting layer at the corresponding location. Using 4 g / L thiourea (comparative example) instead of 1-allyl-2-thiourea, the above steps were repeated for the obtained electrolyte composition. Measurement results such as Figure 4 as shown, Figure 4 is the relationship between the composition of the deposit and the current density obtained by the two electrolyte compositions.

[0076] From Figure 4 It can be seen that at a current density of 2-...

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Abstract

The invention discloses an electrolyte composition for depositing tin alloy on a substrate. The electrolyte composition includes tin ions, one or more alloy metal ions, an acid, a thiourea derivative and an additive selected from the group consisting of alkanolamines, polyethyleneimines, alkoxylated Aromatic alcohols and mixtures thereof. Also disclosed are methods of depositing tin alloys on substrates, and methods of forming interconnect bumps on semiconductor devices.

Description

[0001] Introduction to application [0002] This application claims priority from US Provisional Application No. 60 / 460937, filed April 7, 2003, the entire content of which is incorporated herein by reference. technical field [0003] The present invention relates generally to the field of metal alloys for metal electroplating. More specifically, the present invention relates to electrolyte compositions for depositing tin alloys on substrates and methods of depositing tin alloys on substrates. The present invention also relates to a method of forming interconnect bumps on a semiconductor device. It is especially suitable for forming interconnect bumps on semiconductor devices in semiconductor device packaging. Background technique [0004] Tin and tin-lead alloy deposits are very useful to the electronics industry, especially the inherent properties of the deposits are necessary for the production of printed circuit boards, electrical contacts, electrical connectors, semi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/32C25D3/30C25D3/60C25D13/00G01L1/20H01L21/00H01L21/44
CPCC25D3/60H01L2224/11A46B17/04
Inventor R·贝卡N·D·布朗K·王
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC
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