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Method of mounting electronic component, structure for mounting electronic component, electronic component module, and electronic apparatus

An electronic component installation and electronic component technology, which is applied in the direction of assembling printed circuits with electrical components, printed circuits connected with non-printed electrical components, printed circuit components, etc., can solve problems such as difficulty in ensuring the electrical connection of solder bumps 274

Inactive Publication Date: 2005-02-02
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, since the solder flux cannot be applied on the connection pattern 222 contacting the solder bump 274, it is difficult to ensure the electrical connection between the solder bump 274 and the connection pattern 222.

Method used

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  • Method of mounting electronic component, structure for mounting electronic component, electronic component module, and electronic apparatus
  • Method of mounting electronic component, structure for mounting electronic component, electronic component module, and electronic apparatus
  • Method of mounting electronic component, structure for mounting electronic component, electronic component module, and electronic apparatus

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no. 1 Embodiment

[0046] First, the mounting structure and mounting method of the electronic component of the first embodiment will be described. First, through figure 2 and image 3 , a liquid crystal display device as an electronic component module on which an IC as an electronic component is mounted will be described. in addition, figure 2 is an exploded perspective view of a liquid crystal display device, image 3 for along figure 2 A side sectional view of line A-A in. In addition, in this embodiment, a passive matrix type liquid crystal display device is described as an example, but the present invention can also be applied to an active matrix type liquid crystal display device. in addition, figure 2 and image 3 This is a liquid crystal display device shown schematically. In an actual liquid crystal display device, more electrodes, terminals, and the like are formed.

[0047] (Liquid Crystal Display Device)

[0048] picture figure 2 As shown, in the liquid crystal display ...

no. 2 Embodiment

[0072] pass below Figure 5 The mounting structure and mounting method of the electronic component of the second embodiment will be described. The second embodiment differs from the first embodiment in that the inside of the through hole 63 in the FPC 60 is filled with a conductive thermosetting resin 65 . In addition, specific descriptions of parts having the same configuration as those of the first embodiment are omitted.

[0073] In the electronic component mounting structure of the second embodiment, the inside of the through hole 63 in the FPC 60 is filled with a conductive thermosetting resin 65 . As the thermosetting resin 65 having conductivity, a thermosetting resin 65 containing metal powder or the like is used. As the thermosetting resin, epoxy resin or the like is preferably used. In addition, fine particles of silver (Ag), gold (Au), nickel (Ni) or the like are preferably used as the metal powder. By dispersing such metal powder in the thermosetting resin, the...

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PUM

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Abstract

The invention provides a method of mounting an electronic component where an electronic component can be reliably electrically-connected to a substrate. A substrate defines a through-hole that extends through the substrate, from connection electrodes formed on the lower surface of the substrate, to the upper surface of the substrate. A low melting point metal is connected to the connection electrodes and fills the through-hole. A bump and the low melting point metal are alloyed and bonded by heating the low melting point metal while pressing the bump formed on an electrode pad of an electronic component, with respect to a front end of the low melting point metal. The active surface of the electronic component is sealed by the upper surface of the substrate.

Description

technical field [0001] The present invention relates to an electronic component mounting method, an electronic component mounting structure, an electronic component module (package), and electronic equipment. Background technique [0002] Electronic components such as ICs are used to be mounted on circuit boards or the like. Various methods have been proposed for the method of mounting the electronic component on the circuit board. FIG. 7 is an explanatory view showing a conventional electronic component mounting structure. In FIG. 7( a ), an electronic component 170 such as an IC is mounted on a substrate 120 with an anisotropic conductive film (ACF) 190 interposed therebetween. The anisotropic conductive film 190 is formed by dispersing conductive particles 195 in a thermosetting resin 192 . The conductive particles 195 enter between the electrode pads 172 formed on the active surface of the electronic component 170 and the electrode pads 122 formed on the surface of th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/32H01L21/60H01L23/13H01L23/498H05K1/02H05K1/11H05K1/18H05K3/34H05K3/40
CPCH01L2224/29109H01L2924/0105H01L23/49827H01L2924/01049H01L2224/81801H05K1/112H01L2224/16H05K2201/09472H05K2201/0305H01L2224/13147H01L2924/0132H01L2224/29355H01L23/13H01L2924/01013H01L2224/29298H01L2924/0665H01L2924/0103H01L2224/2919H01L2224/2929H01L2924/0133H01L2224/73204H01L2224/838H01L2924/01033H01L2924/01074H01L2924/01078H01L2224/16225H05K2201/0394H01L2224/29344H01L2924/0781H01L2924/01004H01L2224/16237H05K3/4069H01L24/83H01L2924/01029H01L2224/29111H05K3/4038H05K2201/10674H01L2924/014H01L2224/29101H01L2224/29339H01L24/81H01L2924/01047H01L2924/01079H01L2924/14H01L24/29H01L2924/01005H01L2924/01006H01L2224/8319H01L2924/3025H01L2224/13111H01L2224/16235H01L2924/12042H01L2224/05573H01L2924/00014H01L2924/00H01L2224/05599H05K3/34
Inventor 斋藤淳
Owner SEIKO EPSON CORP
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