Jigsaw

Abstract

The present invention provides a linear saw which can optimize the number, distance and core deflecting amount of the abrasive grain adhered on the linear saw thereby effectively preventing the falling off of the abrasive grain. The linear saw is formed by the following mode, namely, the light permeating the linear saw which is fixed with abrasive grain by the adhesive material at the periphery of the core wire is used to shoot the image of the linear saw, the profile of the abrasive grain is detected according to the brightness of the image of the shot linear saw and does detection thereby mastering the position of the abrasive grain, at least the number, distance and projected area of abrasive grain are detected thereby detecting the respective condition of the abrasive grain and therefore lead to that the projected area of the abrasive grain is 2026300660r above or is 801r below relative to the projected area of the abrasive grain layer, leads to that the standard deviation of the distance of the abrasive grain is 200 mu m or below, and leads to that the ratio between thickness of thin abrasive grain layer to the thickness of thick abrasive grain layer is 0.6 or above for the abrasive grain layer which is spaced with a core wire and is formed at the two side of the core wire.

Description

technical field [0001] The present invention relates to a wire saw that optimizes the adhesion state of abrasive grains on the surface of the wire saw. Background technique [0002] Wire saws have been widely used in recent years for the purpose of cutting silicon wafers from large-diameter silicon ingots. [0003] One such wire saw is a wire saw with a resin bond, which is constructed by using a high-tensile metal as a core wire and covering the core wire with a material such as polyamide, polyimide, etc. An organic material such as an amine resin or an inorganic material such as glass is used as a binder, and abrasive grains are dispersed and contained therein. [0004] Ideally, a certain amount of abrasive grains are regularly adhered at almost equal intervals on the surface of the wire saw, but manufacturing errors may cause confusion in the adhered state of the abrasive grains. [0005] The most influential thing on the cutting performance of the wire saw is the fixat...

AI Technical Summary

Problems solved by technology

Due to the peeling of the adhesive material, the cutting speed will drop sharply, the accuracy of the processed surface will also deteriorate, and the life of the wire saw will be shortened.

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