Anode unit for continuous electroplating of belt poor conductor

A technique for anode devices and conductors, applied in the direction of electrodes, etc., can solve problems such as poor conductivity and uneven current density distribution

Inactive Publication Date: 2005-07-13
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem of uneven current density distribution in the continuous electroplating process of strips with poor conductivity, the present invention provides a strip-shaped poor conductor continuous electroplating anode device for improving the quality and production efficiency of electroplated metals on strips, which can make metal Homogeneous distribution of cathodic current density for electrodeposition for optimum current density control

Method used

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  • Anode unit for continuous electroplating of belt poor conductor
  • Anode unit for continuous electroplating of belt poor conductor
  • Anode unit for continuous electroplating of belt poor conductor

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specific Embodiment approach 1

[0005] Specific embodiment 1: Referring to Fig. 1 to Fig. 3, the anode device of this embodiment is composed of at least one anode unit 1, and the anode unit 1 is composed of a through cavity 2, an upper insulating cover plate 3, and a lower insulating cover plate 4, and the through cavity 2 It is surrounded by the first anode plate 5, the first insulating baffle 7, the second anode plate 6, and the second insulating baffle 8 in sequence. The first anode plate 5 and the second anode plate 6 have the same structure, and the first insulator The baffle 7 and the second insulating baffle 8 have the same structure; the upper insulating cover 3 is connected to the upper port 2-1 of the through cavity 2, the lower insulating cover 4 is connected to the lower port 2-2 of the through cavity 2, and the upper Both the insulating cover plate 3 and the lower insulating cover plate 4 are provided with slits 9, the symmetrical planes of the two slits 9 coincide with the symmetrical planes of ...

specific Embodiment approach 2

[0006] Specific embodiment 2: Referring to Fig. 4, the difference between this embodiment and specific embodiment 1 is that a through cavity 10 is added in the anode unit 1, the structure of the through cavity 10 is the same as that of the through cavity 2, and the lower port 2 of the through cavity 2- 2 connects with the upper port 11 of the through cavity 10 in the same arc, and the symmetrical planes of the through cavity 2 and the through cavity 10 coincide. Other components and connections are the same as those in the first embodiment.

specific Embodiment approach 3

[0007] Specific implementation mode three: Referring to Figures 1 to 3, this embodiment takes the continuous electrodeposition of nickel on the surface of strip-shaped copper foil as an example. The slit 9 on the cover plate 4 enters the through cavity 2, and is derived from the slit 9 on the upper insulating cover plate 3 through the cathode conductive roller 13, wherein: copper foil thickness δ=20 μm, the current lead-in terminal of the anode device is between the cathode and the anode The distance D(0)=30mm, the distance between the cathode and anode at the far end D(L)=10mm, the resistivity of copper ρ Cu =1.63×10 -8 Ω m, resistivity ρ of nickel Ni =20×10 -8 Ω·m, the resistivity ρ of the plating solution L =0.21Ω·m, the density of nickel d=8.9×10 3 kg / m 3 , the amount of electroplated nickel per unit area m = 89 × 10 -3 kg / m 2 (thickness 10 μ m), according to the length L of the through cavity 2, it is obtained by the following formula: L = ...

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Abstract

The anode device for continuous electroplating of belt poor conductor consists of at least one anode unit. The anode unit consists of one through cavity, one upper insulating cover plate and one lower insulating cover plate. The through cavity is formed with the first anode plate, the first insulating baffle, the second anode plate and the second insulating baffle connected successively. The upper insulating cover plate is connected to the upper port of the through cavity, the lower insulating cover plate to the lower port, and both the upper insulating cover plate and the lower insulating cover plate have slot with symmetrical plane coinciding with that of the through cavity. The through cavity has flared longitudinal profile passing through two anode plates. Owing to the special shape of anode to control the current density for electrically depositing metal, the single electroplating bath may have maximum anode length, and the continuous electroplating production line may have least electroplating baths.

Description

Technical field: [0001] The invention relates to an anode device, in particular to an anode device for electroplating metal or alloy on the surface of a strip with poor conductivity. Background technique: [0002] With the continuous development of the application of new materials, the surface metallization of strips with poor conductivity is becoming more and more popular. The electroplating method in aqueous solution has simple equipment, low cost, and is convenient for continuous production. For example, composite metal foil can be prepared by electroplating another metal on the surface of one metal foil, and the obtained Cu / Invar alloy / Cu cladding material is used for electronic packaging; another example is the continuous high-speed electroplating of galvanized, tin and Its alloys are used in automobiles, home appliances, and food packaging industries to reduce product weight and energy consumption. At present, the thickness of thin steel strips has been reduced to 0.10...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/54C25D7/06C25D17/12
Inventor 王殿龙戴长松姜兆华胡信国
Owner HARBIN INST OF TECH
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