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Etching process

An etching and workpiece technology, which is applied in decorative art, gaseous chemical plating, microstructure technology, etc., can solve the problems such as difficult to obtain reflection performance, achieve the effect of improving the accuracy of etching shape, improving operation performance and shortening etching time

Inactive Publication Date: 2005-07-27
SONY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, when the surface of the aluminum film is affected by etching, it is difficult to obtain the original reflective performance

Method used

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Examples

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Effect test

no. 1 example

[0032] Next, refer to figure 1 ,based on figure 2 A flow chart is shown illustrating a first embodiment of an etching method using a processing apparatus having such a configuration. Herein, assuming that the sacrificial layer is selectively etched and removed from the fine etching holes on the front surface side of the substrate S, an example of the etching method will be described below.

[0033] First, in a first step S1 , a substrate S as a workpiece is accommodated and placed in the processing chamber 11 , and a carry-in end of the substrate S is closed to be hermetically sealed inside the processing chamber 11 .

[0034] Subsequently, in a second step 32, pure CO that does not contain entraining agents or other substances 2 It is supplied into the processing chamber 11 from the fluid supply pipe 14 . Here, the treatment chamber 11 is emptied at the same time. In this way, continue to evacuate the inside of the processing chamber 11, and supply CO 2 , until the int...

no. 2 example

[0053] Next, an etching method according to the second embodiment will be described. The etching method according to the second embodiment is a method in which irradiation light h is irradiated only on a portion selected by a mask pattern on a substrate S, and the sequence of steps is similar to that of the reference figure 2 The flow chart illustrates the sequence of steps according to the first embodiment.

[0054] In this case, in figure 1 In the shown processing apparatus, a mask in which a pattern limiting the irradiation range of the irradiation light h is formed is placed on the optical path of the irradiation light h between the light source 21 and the substrate S to perform the fifth step S5.

[0055] Thereby, in the area of ​​one shot irradiated by the irradiation light h, the luminance distribution of the irradiation light h can be formed. So, for example, for Figure 4A and 4B As shown, the hollow part a formed under the structural layer 3 by etching the sacr...

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Abstract

An etching process is provided. The etching process allows etching and removing with a sufficient rate, from a fine etching opening, a sacrificing layer and thereby can form a structure that has a large hollow portion or a complicatedly constituted space portion and furthermore a structure high in the aspect ratio with excellent shape accuracy and without deteriorating a surface state. In the etching process, a work is exposed to a processing fluid that contains an etching reaction species and the processing fluid is maintained in a state where it is flowed relative to the work. In this state, on a surface of the work, illumination light is intermittently illuminated to heat the work intermittently. Thereby, the processing fluid in the neighborhood of the work is intermittently heated and thereby expanded and contracted to etch. As the processing fluid, a substance that contains an etching reaction species and is in a super critical state can be preferably used.

Description

technical field [0001] The present invention relates to an etching method, in particular to an etching method applied in the manufacture of a semiconductor device or a micro-motor. A sacrificial layer is selectively etched and removed to form a fine three-dimensional structure. Background technique [0002] With the development of miniaturization technology, micromotors (micro electromechanical systems: MEMS) and small devices incorporating micromotors therein have attracted attention. A micromotor is an element that electrically and mechanically combines a moving part made of a three-dimensional structure formed on a substrate such as a silicon substrate or a glass substrate, and a semiconductor integrated circuit that controls the driving of the moving part, and constitutes a resonator element etc. such as optical elements and FBAR (Film Bulk Acoustic Resonator). [0003] So far, in this field of micro-motors and semiconductors, a method has been carried out in such a way...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/302B81C1/00H01L21/306H01L21/3065H01L21/311
CPCB81C2201/117B81C1/00047B81C1/00476B81C2201/0142H01L21/3065H01L21/31116H01L21/302
Inventor 村本准一
Owner SONY CORP
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