System and method for testing three-dimensional motion of microstructure by image matching and phase shift interference

Abstract

This invention discloses a system and a method for testing microstructure 3-D motion with image-match and phase shift interference. The system includes an optical microscope, a Mirau interference object glass, its vertical position controller, a strobe lighting driving device, a CCD camera, image collecting cards, a numeric computer and a motion excitation driver, among which, the strobe lighting device drives LEDS of white light and monochromatic light to irradiate the micro structure, which tests the plane motion parameter in white light LED irradiation and tests its out-of -plane motion parameter in monochromatic light LED irradiation. The method includes synchronous control to strobe and drive signals, extraction of plane motion parameter in white light irradiation, set up a relative coordinate system, the obtaining of the surface shape and the extraction coordinate system.

Description

technical field [0001] The invention relates to a method and system for testing three-dimensional motion parameters of microstructures in microelectromechanical systems (MEMS) using image matching and phase shifting interference techniques comprehensively. It belongs to the mechanical quantity measurement technology of the photoelectric non-contact method for micro-electromechanical systems. Background technique [0002] Micro-Electro-Mechanical Systems (MEMS) is developed on the basis of microelectronics technology. It is an integrated device or system composed of electronic and mechanical components. It is manufactured by a mass-processing process compatible with integrated circuits. At the same time, computing, sensing and execution are integrated, thus changing the way of perceiving and controlling the natural world. Most of the manufacturing processes of microelectromechanical systems (MEMS) are compatible with the processing technol...

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Problems solved by technology

Through the comprehensive analysis and comparison of the existing technologies, the technical solutions reported at present mainly have the following problems in practical application: (1) The size range of the microstructure in the MEMS device can reach tens or even hundreds The measurement range of the phase-shift interference method is generally only a few microns from the surface, so the interference fringes can only be formed in a certain area under the entire field of view, that is, the three-dimensional morphology of the microstructure under the entire field of view cannot be obtained; (2 ) Although most of the moving microstructures have off-plane geometric dimensions and motion amplitudes in the range of a few microns, the working distance can be adjusted to make the surface of the moving microstructures form interference fringes, and the edge where the interference fringes disappear generally contains plane motion information, but When using the phase-shifting interferometry method, phase extraction and phase unwrapping steps need to be carried out successively. The edge interference data will easily lead to the failure of the three-dimensional shape extraction. Generally, it is necessary to artificially select the area inside the edge for interference fringe processing. The image edge information The loss of plane motion parameters will make it impossible to extract the plane motion parameters, which will make it difficult to establish the motion measurement coordinate system, and the extraction of out-of-plane motion information will also cause errors; (3) the accuracy of extracting plane motion information using 3D topography is low, which mainly It is difficult to use the sub-pixel technology for the obtained three-dimensional shape, and the measurement accuracy of the plane motion parameters can only reach the pixel level

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