Integral probe card and assembling mode

Abstract

An integrated probe card and the assembly way, it mainly contains, many probes; a electric circuit space switch, with multi-line, and on the two faces the surface, forms the contact separately which leads with this line passes, and the probe on end surface, An elastic electric circuit communication junction panel. Contains board and many elasticities; several chambers on top and bottom formed in the boards, this various elasticities in each chamber separately. A leveling mechanism. The probe, circuit space switch, elastic circuit connection board and the circuit board are fixed by the leveling mechanism.

Description

technical field [0001] The present invention relates to a probe card, specifically an integrated probe card and its assembly method. Background technique [0002] According to the various types of probe cards currently commonly used in the semiconductor industry, such as U.S. Patent No. 4,027,935, No. 4,754,256, No. 5,090,118, No. 5,475,318, and No. 6,072,190... etc., although the structures of the above-mentioned various probe cards , action principles and manufacturing methods are not the same, but they all have a number of shortcomings. For example, in traditional probe cards, the types of probes can be divided into cantilever type (such as epoxy ring probe card) and cantilever type. There are two types of vertical type (vertical type, such as cobra probe card). These two types of probe card types all fix their probes (tungsten needles, lead needles or copper needles) on the printed circuit board ( On the PCB), the height of the probe is also gradually adjusted manually....

AI Technical Summary

Problems solved by technology

[0002] According to the various types of probe cards currently commonly used in the semiconductor industry, such as U.S. Patent No. 4,027,935, No. 4,754,256, No. 5,090,118, No. 5,475,318, and No. 6,072,190... etc., although the structures of the above-mentioned various probe cards , action principles and manufacturing methods are not the same, but they all have a number of shortcomings. For example, in traditional probe cards, the types of probes can be divided into cantilever type (such as epoxy ring probe card) and cantilever type. There are two types of vertical type (vertical type, such as cobra probe card). These two types of probe card types all fix their probes (tungsten needles, lead needles or copper needles) on the printed circuit board ( On the PCB), the height of the probe is also gradually adjusted manually. This will not only result in time-consuming and labor-intensive production, but also result in poor precision of the finished probe card after assembly, and often due to the flatness of the probe The poor degree affects the stability of the test

Moreover, due to the fact that the probes of the traditional probe card have too many exposed parts and no insulation coating, parasitic capacitance and inductance will be generated, resulting in the weakening of high-frequency test signals and the increase of crosstalk.

However, the deformation ability of the probes is too small. When the planarity of the circuit to be tested is not good, it is impossible to ensure that all the probes can effectively contact the test points.

[0003] In addition, the probe density of traditional probe cards manually assembled is approaching the bottleneck. The minimum pitch (min pitch) of cantilever probes is about 50 μm, while the pitch of vertical probes is about 100 μm. Not only the number of pins ( The higher the number of pin counts (the number of probes), the higher the manufacturing cost. Moreover, in terms of the existing probe density bottleneck, it is bound to be unable to meet the needle testing needs of future electronic components.

[0004] Secondly, as for the structure disclosed in US Patent Publication No. US2002 / 0080588A1, the elastic member used to transmit the signal measured by the probe to the circuit board is composed of many curved wires, although each wire There is still a certain gap between the bodies, but there will still be noise (cross talk) between each other, which makes the signal transmitted to the circuit board very prone to errors. For the probe card with high precision, this noise is may result in incorrect test results

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