Integral probe card and assembling mode

A probe card and probe technology, applied in the field of probe cards, can solve problems such as affecting test stability, small probe deformation ability, and easy signal error.

A probe card and probe technology, applied in the field of probe cards, can solve problems such as affecting test stability, small probe deformation ability, and easy signal error.

CN1657949AInactive Publication Date: 2005-08-24IND TECH RES INST

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  • Integral probe card and assembling mode
  • Integral probe card and assembling mode
  • Integral probe card and assembling mode

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0041] see Figure 1 to Figure 1 1. An integrated probe card (100), which provides a preferred embodiment of the present invention, mainly includes a plurality of predetermined number of probes (10), a circuit space converter (20), and a flexible circuit communication connection board (30), a circuit board (40) and a level adjustment mechanism (50), wherein:

[0042] These probes (10) are made by following steps:

[0043] Step 1. Prepare the base material: figure 1 As shown, take a sheet-like wafer substrate (11) (note: it is a side section shown in the figure), and complete necessary pre-treatments such as cleaning and drying (the substrate used in this embodiment ( 11) is a silicon wafer).

[0044] Step 2. Etching recesses on the substrate: if figure 2 As shown, the geometric shape and position of the probe tip (Probe tip) are precisely defined by using the lithography process (Lithography Process; LIGA), and then the anisotropic etching (anisotropicetching) is carried ...

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Abstract

An integrated probe card and the assembly way, it mainly contains, many probes; a electric circuit space switch, with multi-line, and on the two faces the surface, forms the contact separately which leads with this line passes, and the probe on end surface, An elastic electric circuit communication junction panel. Contains board and many elasticities; several chambers on top and bottom formed in the boards, this various elasticities in each chamber separately. A leveling mechanism. The probe, circuit space switch, elastic circuit connection board and the circuit board are fixed by the leveling mechanism.

Description

technical field [0001] The present invention relates to a probe card, specifically an integrated probe card and its assembly method. Background technique [0002] According to the various types of probe cards currently commonly used in the semiconductor industry, such as U.S. Patent No. 4,027,935, No. 4,754,256, No. 5,090,118, No. 5,475,318, and No. 6,072,190... etc., although the structures of the above-mentioned various probe cards , action principles and manufacturing methods are not the same, but they all have a number of shortcomings. For example, in traditional probe cards, the types of probes can be divided into cantilever type (such as epoxy ring probe card) and cantilever type. There are two types of vertical type (vertical type, such as cobra probe card). These two types of probe card types all fix their probes (tungsten needles, lead needles or copper needles) on the printed circuit board ( On the PCB), the height of the probe is also gradually adjusted manually....

Claims

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Application Information

Patent Timeline
24 Aug 2005
Publication
CN1657949A
IPC
G01R1/067; G01R1/073; H01L21/66
Inventors
张智崇; 王宏杰