Composite contact, vacuum switch and method for manufacturing composite contact

A composite contact and mixture technology, which is applied in the direction of contacts, electric switches, contact materials, etc., can solve the problems of restraint limitation, inability to fully improve temperature characteristics, etc., and achieve high performance

Active Publication Date: 2005-09-28
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the suppression of the total resistance of regions 1 and 2 is limited, and the temperature characteristics cannot be sufficiently improved

Method used

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  • Composite contact, vacuum switch and method for manufacturing composite contact
  • Composite contact, vacuum switch and method for manufacturing composite contact
  • Composite contact, vacuum switch and method for manufacturing composite contact

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-5 and comparative example 1-7

[0151] In these Examples and Comparative Examples, except Example 3, a copper plate was used as the copper of the second layer.

[0152] That is, a pure copper plate with a thickness of 2 mm was used as a representative material of the second layer, and a Cu-25%Cr alloy with a thickness of 1 mm was used as a representative material of the first layer.

[0153] Preheat the copper plate at 500°C or higher for 10 minutes or longer. The copper to be used in the Cu-Cr mixed powder is preheated at 350°C or higher for about 1 hour before use. Cr to be used in the Cu-Cr mixed powder is preheated at 1350°C or higher for about 30 minutes or longer before use.

[0154] For the first layer of copper and Cr, prepare such Cu-Cr mixed powder (first layer), wherein the Cr powder with an average particle diameter of 44-105 microns is the same as the copper powder with an average particle diameter in a predetermined ratio (25% by weight) Cr-Cu), mixed evenly. For the second layer of copper, ...

Embodiment 3

[0173] In Example 3, a copper sintered plate was used as the copper of the second layer.

[0174] That is: as the copper and Cr of the first layer, prepare such Cu-Cr mixed powder (first layer), wherein the Cr powder of average particle diameter 44-105 micron is the same copper powder with average particle diameter, with predetermined ratio (25 % by weight Cr-Cu), mixed evenly. As the second layer of copper, a copper sintered plate was prepared, which had 8.0 g / cm 3 Or higher relative density, and rolled into 2mm thick.

[0175] On top of the copper sintered product (second layer), place Cu-Cr mixed powder (first layer), these two layers remain unchanged (keep the load), and undergo a predetermined preliminary heating process (900-1150 ° C) for about For 1 hour (in step b), the Cu-Cr alloying of the Cu-Cr mixed powder (first layer) and the alloying of the interface between the first layer and the second layer are simultaneously achieved. Thus, a composite contact is obtaine...

Embodiment 6-7 and comparative example 8-9

[0177] As the first layer of copper and Cr, prepare such Cu-Cr mixed powder (first layer), wherein the Cr powder with an average particle diameter of 44-105 microns is the same as the copper powder with an average particle diameter in a predetermined ratio (5-90 % by weight Cr-Cu), mixed. As the copper of the second layer, a copper plate was prepared.

[0178] On top of the copper plate (2nd layer), place Cu-Cr mixed powder (1st layer), these two layers are in contact with each other as they are, (holding the load), and bonded to each other in such a way that at 6 t / cm 2 or lower pressure, such as 2 tons / cm 2 , subjected to preliminary pressurization, and then subjected to a preliminary heating process (900-1150°C) for about 1 hour, simultaneously achieving Cu-Cr alloying of the Cu-Cr mixed powder (first layer) and the relationship between the first layer and the second layer alloying at the interface. Thereby, a composite contact is obtained in which the two layers (firs...

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Abstract

Disclosed is a composite contact which comprises a first layer which contains a Cu-Cr mixture and a second layer which contains Cu, wherein, Cr power or particles with mean diameter of 0.1-150 mum and Cu power or particles with mean diameter of 0.1-150 mum are mixed according to the scaling ratio of 15-60145402070f Cr by weight to allowance of Cu to form the first layer.The first layer and the second layer are bonded with each other, at the same time, Cu in the first layer enters a range of 20-100 mum of the second layer from the interface of the first layer and the second layer, and Cu in the second layer enters a range of 20-100 mum of the first layer from the interface.

Description

[0001] related cross-references [0002] This application claims priority from the prior Japanese Patent Application No. 2004-82961 filed on March 22, 2004, and the prior Japanese Patent Application No. 2004-258155 filed on September 6, 2004, the entire contents of which are hereby incorporated by reference for reference. technical field [0003] The invention relates to such a compound contact, which can realize the compatibility of the interruption characteristic and the especially stable temperature characteristic (temperature rise suppression characteristic); the invention also relates to a vacuum switch with a vacuum tube, comprising the compound contact; the invention It also relates to a method of manufacturing the composite contact. Background technique [0004] In a vacuum circuit breaker, three basic requirements are prioritized: large current interruption characteristics, withstand voltage characteristics, and welding resistance characteristics. But among these ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01H1/02
CPCH01H1/0206
Inventor 奥富功草野贵史本间三孝山本敦史関経世长部清
Owner KK TOSHIBA
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