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Vice mounting board and semiconductor apparatus using device mounting board

A technology for mounting substrates and semiconductors, used in semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., and can solve problems such as interlayer peeling, reduced position accuracy, and reduced yield.

Inactive Publication Date: 2005-10-05
SANYO ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] As a result, a decrease in the adhesion between the insulating resin layers of the multilayer insulating film or delamination between the layers may occur, resulting in a decrease in yield.
Or, due to the bending of the element mounting substrate, the positional accuracy when connecting semiconductor elements by flip-chip or wire bonding and other connection methods is reduced, and the yield rate is reduced.

Method used

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  • Vice mounting board and semiconductor apparatus using device mounting board
  • Vice mounting board and semiconductor apparatus using device mounting board
  • Vice mounting board and semiconductor apparatus using device mounting board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0081] Figure 10B is a cross-sectional view showing an element mounting substrate having a four-layer ISB structure according to the present embodiment.

[0082] The element mounting substrate of this embodiment has a structure in which an insulating resin film 312 and a photoresist film 328 are sequentially laminated on the upper surface of a base material 302 . In addition, the lower surface of the base material 302 has a structure in which an insulating resin film 312 and a photoresist film 328 are sequentially laminated.

[0083]In addition, a through hole 327 penetrating through the base material 302 , the insulating resin film 312 , and the photoresist film 328 is provided.

[0084] In addition, a part of the wiring made of the copper film 308 , a part of the wiring made of the copper film 320 , a part of the communication part 311 , and the like are embedded in the base material 302 . A part of the wiring made of the copper film 308 , a part of the wiring made of the...

Embodiment approach 2

[0187] Figure 16A to Figure 16D It is a schematic cross-sectional view showing various semiconductor devices in which semiconductor elements are mounted on the element-mounting substrate described in Embodiment 1.

[0188] There are various types of semiconductor devices in which semiconductor elements are mounted on the element-mounting substrate described in Embodiment 1 above. For example, a form mounted by flip chip or wire bonding connection. In addition, there is also a form in which a semiconductor element is mounted on an element mounting substrate in a face-up structure or a face-down structure. In addition, a semiconductor element is mounted on one side or both sides of the element mounting substrate. There are also forms that combine these forms.

[0189] Specifically, for example Figure 16A As shown, the semiconductor element 500 such as LSI can be mounted on the upper part of the element mounting substrate 400 of Embodiment 1 in a flip-chip format. At this ...

Embodiment approach 3

[0197] According to this embodiment, there can be provided an element mounting substrate for mounting elements, which includes: a base material; Any insulating layer among the second and second or more insulating layers counted from the base material side has a Kalduo type polymer, and the insulating layer having a Kalduo type polymer is more than the insulating layer having a Kalduo type polymer and the base material. The insulating layer between them is thick.

[0198] The bulky substituents of Kaldor-type polymers hinder the movement of the main chain, so they have excellent mechanical strength, heat resistance and low linear expansion rate. In this manner, the decrease in the adhesion between the insulating resin layers of the multilayer insulating film of the element mounting substrate, delamination, and the like are suppressed during thermal cycles. Therefore, an element mounting substrate excellent in reliability and heat resistance can be stably provided.

[0199] In...

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PUM

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Abstract

The device mounting board according to the first embodiment has the structure in which an dielectric resin film and a photoimageable solder resist film are sequentially laminated on an upper surface of a base material. The device mounting board also has the structure in which the dielectric resin film and the photoimageable solder resist film are sequentially laminated on a lower surface of the base material. The photoimageable solder resist film contains the cardo type polymer.

Description

technical field [0001] The present invention relates to an element mounting substrate, a manufacturing method thereof, and a semiconductor device using the same. Background technique [0002] In the accelerated development of high-performance portable electronic devices such as mobile phones, PDAs, DVCs, and DSCs, in order for such products to be accepted by the market, it is necessary to realize their small size and light weight, which requires a highly integrated system LSI. On the other hand, these electronic devices are required to be easy to use and easy to operate, and LSIs used in equipment are required to have higher functionality and higher performance. For this reason, with the high integration of LSI chips, the number of I / Os has increased, but the miniaturization of the package itself is also required to be high. In order to take into account both, it is suitable for semiconductor packages mounted on high-density substrates of semiconductor components. Developme...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/48H01L23/12H01L23/498H01L23/58H05K1/03H05K3/28H05K3/46
CPCH01L24/48H01L2924/01046H05K3/287H01L2924/01079H01L2924/3025H01L2224/48227H01L2924/15311H01L2924/19041H01L2224/16H01L23/49894H01L2924/01078H01L21/4857H01L2224/49171H01L2924/01019H01L2224/16225H01L2924/19105H05K3/4602H01L24/49H01L2224/45144H01L2924/12042H01L2924/181H01L2224/05554H01L2924/00014H01L24/45H01L2924/00H01L2924/00012H01L2224/45015H01L2924/207
Inventor 臼井良辅中村岳史水原秀树
Owner SANYO ELECTRIC CO LTD