Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Plasma processing apparatus, process vessel for plasma processing apparatus and dielectric plate

A technology for plasma and processing containers, applied in the field of plasma processing devices, can solve problems such as reduced efficiency, damage to metal containers, damage to dielectric plates, etc.

Active Publication Date: 2005-11-30
TOKYO ELECTRON LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the conventional plasma processing apparatus, at the contact portion between the dielectric plate and the metal processing container, particles such as friction and cutting of the metal container are generated due to the difference in thermal expansion coefficient between the two.
In the worst case, damage such as breakage of the dielectric plate occurs
In addition, partial discharge occurs at the electric field boundary portion at the edge of the dielectric plate, which not only damages the metal container, but also reduces the efficiency of plasma processing such as oxide film formation.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Plasma processing apparatus, process vessel for plasma processing apparatus and dielectric plate
  • Plasma processing apparatus, process vessel for plasma processing apparatus and dielectric plate
  • Plasma processing apparatus, process vessel for plasma processing apparatus and dielectric plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0010] FIG. 1 shows a schematic configuration of a plasma substrate processing apparatus 10 used in the present invention. The plasma processing apparatus 10 has a processing container 11 including a substrate holding table 12 holding a silicon wafer W serving as a substrate to be processed. The gas in the processing container 11 is exhausted from the exhaust ports 11A and 11B through an exhaust pump (not shown). The substrate holding table 12 has a heating function for heating the silicon wafer W. As shown in FIG.

[0011] On the device upper side of the processing container 11 , an opening is provided corresponding to the silicon wafer W on the substrate holding table 12 . The opening is made of quartz or Al 2 o 3 The formed dielectric plate 13 is clogged. On the upper portion (outer side) of the dielectric plate 13, the slot plate 14 functioning as an antenna is arranged. A dielectric plate 15 made of quartz, alumina, aluminum nitride, or the like is arranged on the up...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Damage to a dielectric plate supporting unit and a metal vessel is kept to a minimum and the efficiency of plasma processing is improved. A resin layer is provided in a region where a dielectric plate and a processing vessel face each other. With this structure, particles and damage attributed to the difference of thermal expansion coefficients between the dielectric plate and the process vessel can be suppressed. In addition, local discharges at electric field boundaries such as edge portions of the dielectric plate are suppressed, thereby improving the efficiency of plasma processing such as formation of an oxide film.

Description

technical field [0001] The present invention relates to a plasma processing apparatus for processing a semiconductor substrate with plasma, and more particularly to the structure of a processing container and a dielectric plate used in the plasma processing apparatus. Background technique [0002] In recent years, the development of processing technology for semiconductor substrates using plasma has been remarkable. Plasma treatment has advantages such as that the treatment temperature can be significantly lowered compared with the prior art. A plasma processing apparatus generally includes: a processing container for storing a semiconductor substrate; an electromagnetic wave supply unit for supplying electromagnetic waves to the processing container; and a dielectric plate (dielectric window) arranged between the electromagnetic wave supply unit and the processing container. In the apparatus configured in this way, mixed gases corresponding to different processes are intro...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05H1/46B01J19/08H01J37/32H01L21/00H01L21/31
CPCH01L21/67069H01J37/32458H01L21/31H05H1/46
Inventor 森田治
Owner TOKYO ELECTRON LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com