Polyimide film and its producing process

A technology of polyimide film and manufacturing process, which is applied in flat products, other household appliances, applications, etc., and can solve the problems that polyimide film products cannot meet the needs of microelectronics and information industries

Inactive Publication Date: 2006-03-22
JIANGSU YABAO INSULATION MATERIAL
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  • Abstract
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Problems solved by technology

[0003] The purpose of the present invention is to provide a polyimide film with ultra-wide and ultra-thick for the specification of existing polyimide film pro

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  • Polyimide film and its producing process

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Embodiment Construction

[0007] The present invention uses pyromellitic dianhydride as the main raw material, 4.4'-diaminodiphenyl ether and dimethylacetamide as auxiliary materials, pyromellitic dianhydride, 4.4'-diaminodiphenyl ether, dimethyl The weight ratio of acetamide is 0.6-0.7%, 0.55-0.65%, 3.5-4.0%, respectively, the thickness of the polyimide film is 0.25-0.35mm, and the width is 1250-1500mm; its manufacturing process mainly It includes resin synthesis, viscosity test, filtration, defoaming, salivation film formation, imidization treatment and stretching process, winding, slitting in sequence; Put the amide solvent into the dissolution kettle, put the weighed 4.4'-diaminodiphenyl ether into it, start the corresponding mixer to stir and dissolve, the dissolution time is not less than one and a half hours, and wait until the 4.4'-diaminodiphenyl ether is completely dissolved Finally, stop stirring, use compressed air to press the 4.4'-diaminodiphenyl ether solution through the filter into the...

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Abstract

The polyimide film and its production process belong to the field of insulating material producing technology. The production process has pyromellitic dianhydride as main material, and 4, 4-diaminodiphenyl ether and dimethylacetamide as supplementary material, and includes the main steps of: resin synthesis, viscosity measurement, filter, debubbling, casting to form film, winding and cutting. The present invention features the polyimide film with thickness of 0.25-0.35 mm and width of 1250-1500 m, the reaction of pyromellitic dianhydride and 4, 4-diaminodiphenyl ether in dimethylacetamide and the optimized technological process to make the product meet the requirement of producing flexible printed circuit board and other information industry production.

Description

technical field [0001] The invention relates to a polyimide film and its manufacturing process. The polyimide film is a high temperature resistant insulating material, which is widely used in aerospace, electrical machinery, instrument communication and other industrial sectors, especially in microelectronics and information industries. Widely demanded, belonging to the technical field of insulating material manufacturing. Background technique [0002] Polyimide film is a high temperature resistant insulating material developed in the early 1960s in the United States. It has excellent mechanical properties, dielectric properties, chemical resistance and radiation resistance in the range of -200-400 °C. Widely used in aerospace, electrical machinery, means of transportation, conventional weapons, vehicles, instrument communications, petrochemical and other industrial sectors. With the development of application technology, the microelectronics and information industries have ...

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Application Information

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IPC IPC(8): B29C69/00B29C71/00C08J3/00B29K77/00B29L7/00
Inventor 宋成根苗培权陆启俊
Owner JIANGSU YABAO INSULATION MATERIAL
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