Low melting-point alloy powder spheroidizing and nano microcrystallizing process

The technology of alloy powder and process method is applied in the field of low melting point lead-free solder alloy powder spheroidization, microcrystalline and nanotechnology, which can solve the problem of not finding literature and the like, and achieve the effects of low cost and simple process

Inactive Publication Date: 2006-05-24
SHANGHAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Regarding the technology of solvent color coating and melting alloy powder to make the powder spheroidize from re

Method used

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  • Low melting-point alloy powder spheroidizing and nano microcrystallizing process
  • Low melting-point alloy powder spheroidizing and nano microcrystallizing process

Examples

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Embodiment 1

[0016] (1) at first 2g composition is that a kind of lead-free solder alloy of Sn-57wt%Bi is placed in the organic solvent mixed solution of 20ml by the low melting point alloy powder of irregular shape that high-pressure gas atomizing agent makes; The organic solvent mixes The liquid is prepared by the spheroidizing agent dibutyl decane dibutyrate and the dispersing agent polyethylene glycol octyl phenyl ether in a weight ratio of 1:1, and then it is dispersed evenly by an ultrasonic oscillator;

[0017] (2) Place the organic solution mixture with the Sn-57wt% Bi alloy powder in a resistance furnace for heating, so that the temperature of the solution mixture reaches 260° C.;

[0018] (3) Keep the above solution at the above temperature for 3 minutes at a constant temperature to ensure that the powder is completely melted, then make it automatically cool down to 150°C, and then quickly liquid quench it in an aqueous solution at room temperature, wait for a while, filter, wash,...

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Abstract

The present invention relates to a low melting point lead-free welding flux alloy powder spheroidization and microcrystal nano formation process. Said invention is characterized by that said method utilizes the low melting point alloy powder with irregular forms which is obtained by high-pressure gas atomization and adopts the following steps: using organic spheroidizing afent dibutyl sebacate and organic dispersing agent polyoxyethylene actyl phenyl ether to prepare organic solvent mixture solution, uniformly mixing said alloy powder and organic solvent and making the alloy powder be dispersed in said organic solvent, heating and melting, then quickly extracting and cooling so as to obtain the spheroidized powder and microcrystal nano alloy microparticles.

Description

technical field [0001] The invention relates to a low-melting-point lead-free solder alloy powder spheroidization microcrystal nanotechnology method, which belongs to the technical field of metal material processing. Background technique [0002] As a kind of green electronic material, lead-free solder low melting point alloy material is usually prepared by atomization method. Due to the high quality requirements of electronic products, there are high requirements for the sphericity, particle size, distribution and solidification structure of lead-free solder. Lead-free solder is an inevitable trend in the development of human green electronic material production technology in the 21st century. The higher the sphericity, the more uniform the particle size, and the finer the solidification structure of lead-free solder for electronic products, the better its performance. At the same time, its particle size range is usually controlled between 5 and 74 μm. [0003] Regarding ...

Claims

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Application Information

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IPC IPC(8): B22F1/00B22F9/08
Inventor 翟启杰官万兵高玉来徐匡迪
Owner SHANGHAI UNIV
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