Method for ingelligent optimizing procedure of semiconductor packing producing line

An intelligent optimization and production line technology, applied in semiconductor/solid-state device manufacturing, instruments, adaptive control, etc., can solve the problems of few simulation studies on semiconductor packaging production lines, complex and variable production systems, etc., and achieve a reasonable average occupancy rate of machines, Fast convergence speed and convenient effect
CN1786854AInactive Publication Date: 2006-06-14TONGJI UNIV
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
TONGJI UNIV
Publication Date
2006-06-14
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention provides an intelligent method for optimizing working procedure of a semiconductor packaging production line, applying particle swarm optimization (PSO) to optimize the working procedure in a semiconductor packaging process, modeling and finding the solution, taking processing center as a unit, building a mapping relation between problem to be solved and particle swarm, using particles to express optional solutions to the problem, and finding the optimized solution under the guidance of corresponding target; each particle swarm optimization subproblem is using processing time of the machine on the production line for different products to encode the particles to determine particle swarm optimization space and making time sequence decoupling on the optimization problem to be solved, obtaining the corresponding subproblem and then dividing the problem space and determining a mapping relation between the divided space and each subproblem to find particle swarm optimization solution of each subproblem, thus obtaining an optimized machine processing time allocating solution and machine occupation ratio. The practice indicates that PSO has the advantages simple concept, convenient implementation, rapid convergence, etc.
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Description

Technical field

[0001] The invention relates to an intelligent optimization method for the procedures of a semiconductor packaging production line, and belongs to the technical field of semiconductor manufacturing. Background technique

[0002] With the development of information technology and electronic technology, the semiconductor manufacturing industry has quickly become a very important industry, occupying an increasingly important position in the national economy. Due to the huge investment, complex manufacturing process, and extremely fast updating of products and equipment, the control and optimization of its manufacturing process are very important. Semiconductor manufacturing is considered to be one of the most complex manufacturing processes today. It has the characteristics of reentrancy, high uncertainty, high complexity, and multi-objective optimization. Its control and optimization issues have received extensive attention.

[0003] Generally, the semiconductor pro...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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