Adhesive sheet, dicing tape intergrated type adhesive sheet, and semiconductor device producing method

A technology for cutting tapes and adhesive sheets, which is applied in semiconductor/solid-state device manufacturing, bonding methods, semiconductor devices, etc., and can solve problems such as cracking, reduced bonding reliability, and difficulty in cutting at the same time

Active Publication Date: 2006-07-05
HITACHI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Using the above-mentioned half-cutting or dark-cutting, in the process of carrying out semiconductor device manufacturing by the above-mentioned method of sticking the back of the wafer, the adhesive sheet and the wafer must be cut at the same time, but in the case of using a general adhesive sheet, it must be bonded to the wafer. While cutting is difficult
In addition, when a non-stretchable adhesive sheet with good breakability is used as the adhesive sheet, the cut surface of the wafer and the adhesive sheet can be cut at the same time, but the fluidity of the non-stretchable adhesive sheet is low, so it is difficult to It is difficult to paste on the wafer at a low temperature below 100°C, and the adhesive sheet itself is very brittle, which may cause cracks and reduce the reliability of bonding

Method used

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  • Adhesive sheet, dicing tape intergrated type adhesive sheet, and semiconductor device producing method
  • Adhesive sheet, dicing tape intergrated type adhesive sheet, and semiconductor device producing method
  • Adhesive sheet, dicing tape intergrated type adhesive sheet, and semiconductor device producing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0113] Epoxy resin uses bisphenol F type epoxy resin (epoxy group equivalent is 160, and East Capital Chemical Co., Ltd. manufactures, trade name is YD-8170C) 30 weight parts; The block type epoxy resin of cresol (epoxy group The equivalent is 210, manufactured by Tohto Chemical Co., Ltd., trade name YDCN-703) 10 parts by weight: the hardener of epoxy resin uses the block resin of phenol (manufactured by Dainippon Inki Chemical Industry Co., Ltd., trade name is プテイオ- フエンLF2882) 27 parts by weight; The acrylic rubber containing epoxy group (the weight average molecular weight that gel permeation chromatography method records as the acrylic system copolymer containing epoxy group is 800,000, glycidyl methacrylate 3 weight parts %, Tg is-7 DEG C, manufactured by Nagase Chemtex, trade name is HTR-860P-3DR) 28 parts by weight; as hardening accelerator imidazole series hardening accelerator (Shikoku Chemical Industry Co., Ltd. manufactures キエアゾル 2PZ-CN) 0.1 Parts by weight; Silica fi...

Embodiment 2～6

[0116] Using the compositions shown in Table 1, an adhesive sheet was prepared in the same manner as in Example 1. The PSA sheet of Example 6 is a PSA sheet obtained in Example 1, which was heat-treated at 40° C. for 24 hours to reduce the elongation at break.

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Abstract

The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100 DEG C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Description

technical field [0001] The present invention relates to an adhesive sheet suitable for bonding a semiconductor element to a semiconductor element mounting support member, an adhesive sheet integrated with a dicing tape, and a method for manufacturing a semiconductor device. Background technique [0002] Conventionally, silver glue has been mainly used to bond the semiconductor element and the supporting member for mounting the semiconductor element. However, along with the miniaturization and high performance of semiconductor elements in recent years, miniaturization and refinement of support members are also required. For such requirements, due to the inconvenience of using silver glue for wire connection, it will cause protrusion or skew of semiconductor elements, it is difficult to control the film thickness of the adhesive sheet, and the adhesive sheet produces pores, etc., which cannot be well met. above requirements. Therefore, in order to meet the above-mentioned re...

Claims

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Application Information

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IPC IPC(8): H01L21/301C09J7/00H01L21/52B23K26/064B23K26/38B23K26/40C09J5/00C09J7/10C09J7/20C09J7/25C09J7/35C09J7/38C09J11/02C09J201/00
CPCH01L24/27H01L2224/83191H01L2224/274H01L2924/01005H01L2924/01029H01L2924/01079H01L2924/01012H01L2221/68336H01L2224/2919H01L2224/94H01L2924/3512H01L2924/00H01L2224/27
Inventor 稻田祯一增野道夫宇留野道生
Owner HITACHI CHEM CO LTD
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