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Epoxy resin composition for semiconductor encapsulation and semiconductor device

An epoxy resin and semiconductor technology, which is applied to semiconductor devices, semiconductor/solid-state device components, and electric solid-state devices, etc., can solve the problems of epoxy resin compositions with high resistivity, high insulation, and insufficient electrical properties. Achieve the effect of avoiding short circuit or leakage, preventing re-agglomeration, and avoiding deformation of metal wires

Active Publication Date: 2006-07-12
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, with resistors containing 10 7 The electronic component device of the component encapsulated with the epoxy resin composition of the non-conductive carbon of Ω or more can prevent the short circuit or leakage of the wiring, but due to the high insulation, the regenerated particles with a particle size of about 80 μm or more are generated due to static electricity. Agglomerates, the re-agglomerates are sandwiched between metal wires to cause deformation of metal wires or flow of metal wires, so there is a problem of insufficient electrical characteristics
Hitherto, there has not been reported an epoxy resin composition that has a high resistivity and does not generate reagglomerates caused by static electricity, and thus development of such products is strongly desired

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The compounding components in Table 1 were mixed at normal temperature with a mixer, melted and kneaded with a heating roll at 80 to 100° C., and the kneaded product was cooled and pulverized to obtain an epoxy resin composition. The obtained epoxy resin composition was evaluated by the following evaluation method. The results are shown in Table 2.

[0027] Biphenyl type epoxy resin; "YX4000"

Melting point 105°C,

Epoxy resin equivalent 195g / eq, oily shell ring

Manufactured by Oxygen Co., Ltd.

8.5 parts by weight

Phenolic resin for phenol paint; softening point 65°C,

Hydroxyl equivalent 104g / eq

4.5 parts by weight

Spherical fused silica; average particle size 22μm,

Maximum particle size 75μm

84.4 parts by weight

Carbon Precursor A; "CB-3-600",

H / C weight % ratio = 3 / 96, average particle diameter

3μm, maximum particle size 20μm, resistivity value 1

×10 6 Ω·cm, manufactured by Mitsui Mi...

Embodiment 2～ Embodiment 4

[0044] In addition to using 1.8 parts by weight (Example 2), 3.0 parts by weight (Example 3), and 0.5 parts by weight (Example 4) instead of 1.0 parts by weight of the carbon precursor A, the same method as in Example 1 was used. method to proceed. In addition, the blending amount of the spherical fused silica was adjusted according to the change in the blending amount of the carbon precursor A.

Embodiment 5

[0046] It carried out similarly to Example 1 except having used the following carbon precursor B instead of carbon precursor A. The results are shown in Table 2.

[0047] The carbon precursor B; the spherical phenol resin with an average particle diameter of 15 μm was dried, and fired at 650° C. for 4 hours to obtain the carbon precursor B with a yield of 99%. The physical properties of the obtained carbon precursor B were hydrogen / carbon weight % ratio=2 / 97, the average particle size was 10 μm, the maximum particle size was 30 μm, and the resistivity value was 1×10 4 Ω·cm.

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PUM

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Abstract

Outstanding YAG laser marking characteristics can be obtained without electric defects such as a short circuit and leak current and without deforming gold wires by using an epoxy resin composition for semiconductor sealing comprising an epoxy resin, a phenol resin, an inorganic filler, a curing accelerator, and a carbon precursor having a specific electric resistivity in a semiconductor region of 1x10<2>.cm or more but less than 1x10<7>.cm as essential components, wherein the amounts of the inorganic filler and the carbon precursor in the epoxy resin composition are respectively 65-92 wt % and 0.1-5.0 wt %.

Description

technical field [0001] The present invention relates to an epoxy resin composition for semiconductor encapsulation excellent in laser marking properties and electrical properties, and a semiconductor device using the epoxy resin composition. Background technique [0002] Conventionally, semiconductor devices mainly encapsulated with an epoxy resin composition contain conductive carbon black as a colorant in the composition. If an epoxy resin containing carbon black is used as a colorant, the shielding property of the semiconductor element is excellent, and when the product name and lot number are marked on the semiconductor device in white, the background is black, so more vivid printing can be obtained. Especially recently, manufacturers of electronic components using easy-to-handle YAG laser marking are increasing, and carbon black that absorbs the wavelength of YAG laser has become an essential component of epoxy resin compositions for semiconductor encapsulation. [000...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L61/06H01L23/29
CPCH01L2924/0002H01L23/293C08L61/06C08L63/00Y10T428/31511C08L61/04H01L2924/00
Inventor 前田将克
Owner SUMITOMO BAKELITE CO LTD
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