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Ultrafast recovery diode module

A recovery diode, ultra-fast technology, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of poor recovery time compatibility, large changes in reverse leakage current, and inapplicability, so as to optimize the installation position and avoid noise , the effect of high frequency

Active Publication Date: 2006-09-06
CHANGZHOU RUIHUA POWER ELECTRONICS DEVICES
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Problems solved by technology

[0002] The ultrafast recovery diode modules currently commonly used are composed of a single ultrafast recovery silicon diode chip, a main electrode, and a copper base plate without pre-bending. The upper end of the ultrafast recovery silicon diode chip is directly connected to the main electrode, and the lower end is directly connected to the main electrode. Soldered on the copper base plate without pre-bending, the recovery time compatibility of this ultra-fast recovery diode module is poor, and the reverse leakage current changes greatly, so it cannot be applied to the field with strict recovery time change requirements

Method used

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  • Ultrafast recovery diode module

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Embodiment Construction

[0009] The specific embodiment of the utility model is described below in conjunction with accompanying drawing:

[0010] The ultra-fast recovery diode module of the present invention includes a red copper base plate 1, an aluminum nitride ceramic copper-clad plate (ie AL N DBC plate) 2, a PBS plastic shell 3, a fastening ring 4, a PBS plastic cover plate 5, and three main electrodes 6-8, three terminal screws 9, epoxy resin protection layer 10, RTV silicone rubber protection layer 11, ultra-fast recovery diode chip 12, two-component elastic silicone gel protection layer 13, internal connection wire 14, ultra-fast recovery The diode chip 12 is fixed on the main electrodes 6-8 by silver-tin welding, the three main electrodes 6-8 are fixed on the aluminum nitride ceramic copper-clad laminate 2 by silver-tin welding, and the aluminum nitride ceramic copper-clad laminate 2 is soldered by silver-tin The welding method is fixed on the red copper base plate 1, and the ultra-fast reco...

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Abstract

The present invention discloses a ultra-fast restorer diode module. It contains red copper base plate, aluminium nitride ceramics coller clad plate, plastic casing, three main electrodes, epoxy protective layer, double compositions elastic silicon gel protective layer, RTV silicone rubber protective layer, ultra-fast restorer diode chip in connection wire, said red copper processed by pre-bending. Said invention has high frequency, ultra-fast recovering, ultra-soft and super - durable property.

Description

technical field [0001] The invention relates to a power semiconductor device, in particular to an ultrafast recovery diode module. Background technique [0002] The ultrafast recovery diode modules currently commonly used are composed of a single ultrafast recovery silicon diode chip, a main electrode, and a copper base plate without pre-bending. The upper end of the ultrafast recovery silicon diode chip is directly connected to the main electrode, and the lower end is directly connected to the main electrode. Soldered on a copper base plate without pre-bending, this ultra-fast recovery diode module has poor recovery time compatibility and large changes in reverse leakage current, so it cannot be applied to fields with strict requirements for recovery time changes. Contents of the invention [0003] The object of the present invention is to provide an ultrafast recovery diode module and a manufacturing method thereof. [0004] The ultra-fast recovery diode module of the p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/03H01L23/488H01L23/28
Inventor 陈兴忠颜书芳
Owner CHANGZHOU RUIHUA POWER ELECTRONICS DEVICES
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