Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Composite vibration damping type photolithography device

A technology of lithography and active vibration reduction, which is applied in the direction of photolithography exposure devices, microlithography exposure equipment, electrical components, etc., can solve the problems of reduced dynamic stability, increased relative vibration modes of the optical axis, and increased synchronization errors. Large and other problems, to achieve good seismic/vibration performance, good dynamic characteristics, and the effect of isolating vibration transmission

Active Publication Date: 2006-09-27
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
View PDF0 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the system is subjected to a sudden high disturbance, the dynamic stability of the conventional design will be significantly reduced, resulting in an increase in the relative vibration mode between the mask and the optical axis of the exposure system, causing a sharp increase in synchronization error, so the scanning exposure Quality makes a big difference
[0003] For new or next-generation lithography and other equipment, when the system physical parameters of the optical device are not good, such as high center of gravity, the existing lithography system is difficult to meet the requirements

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Composite vibration damping type photolithography device
  • Composite vibration damping type photolithography device
  • Composite vibration damping type photolithography device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0022] figure 1 , contains the specific implementation of the two design forms of the present invention, wherein the solid line part and the double dashed line part together constitute the design form of the unified active vibration isolation, and the solid line part and the single dashed line part together constitute the independent active vibration vibration isolation design form. The illumination system 115 provides projection beams, such as EUV and EUV light sources.

[0023] Such as figure 1 and figure 2 As shown, the entire lithography device is located on the vibration isolation foundation 101, the precision subsystems of the whole machine are organically linked together through the basic frame 102 of the whole machine, and the active vibration reduction system 106 is placed on the basic frame 102 of the whole machine, and all subsys...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

This invention relates to a composite vibration damping type photolithography device. Wherein, the device comprises a uniform active vibration-reduction support or a platform system on the frame, a mask platform system, a lighting system, and an exposure system all supported on the basic frame by different vibration reduction devices. Wherein, it is better to improve the system dynamic performance with grain damper. This invention reduces various disturbances effectively for vibration reduction design with precise positioning request.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, and relates to a photolithography equipment, in particular to a compound vibration-damping photolithography device. Background technique [0002] In the current semiconductor industry, the well-known production and manufacturing equipment are all integrated with the limit technology of optomechanical and electrical. Interference from various aspects such as ground vibration cannot be ignored. The workbench or equipment used to realize the production function must be placed on the support system and vibration isolation system that will not be disturbed by the outside world. The strength of the vibration isolation system's ability to suppress the interference of the external environment and the quality of its dynamic stability are the keys to whether semiconductor equipment and other high-precision equipment can realize their functions and work effectively. For example, for lit...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20H01L21/027
Inventor 严天宏
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com