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Refining method for copper chloride etching waste liquid and refined copper chloride solution

A technology of etching waste liquid and refining method, applied in copper chloride, chemical instruments and methods, copper halide and other directions, can solve the problems of high operation cost and complicated operation.

Active Publication Date: 2006-10-04
TOAGOSEI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the technique is cumbersome because copper is adsorbed on the anion exchange resin, followed by two-stage desorption of impurity metals and copper.
In addition, because hydrochloric acid is used in the desorption, the operation cost of this part is high
In addition, in this patent document 4, for liquids with a copper concentration of less than 1.5% by weight, it is not disclosed that iron and zinc are removed from high-concentration copper chloride etching waste liquids with a copper concentration of, for example, 6% by weight or more, and copper is separated.

Method used

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  • Refining method for copper chloride etching waste liquid and refined copper chloride solution
  • Refining method for copper chloride etching waste liquid and refined copper chloride solution
  • Refining method for copper chloride etching waste liquid and refined copper chloride solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] As the anion exchange resin, a 100 mL portion of strongly basic anion exchange resin "DIAION (registered trademark) PA316" produced by Mitsubishi Chemical Corporation was packed in the column, and the column was filled at SV=1.5 hr. -1 Make the copper chloride etching waste liquid pass through. The so-called SV is an abbreviation for Space Velocity. The composition of the copper chloride etching waste liquid had a Cu concentration of 10.2%, a free HCl concentration of 7.6%, a Fe concentration of 320 ppm, a Zn concentration of 40 ppm, and a pH of -1.3. In addition, the liquid temperature is controlled at 60±2°C. figure 2 Indicates the result of analyzing the liquid discharged from the column.

Embodiment 2

[0050] In addition to the composition of the copper chloride etching waste liquid, the concentration of Cu is 8.6%, the concentration of free HCl is 1.5%, the concentration of NaCl is 9.3%, the concentration of Fe is 5ppm, the concentration of Zn is 43ppm, the pH is -0.5, and the temperature of the liquid is controlled at Except for 20±2°C, the test was performed in the same manner as in Example 1. image 3 Indicates the result of analyzing the liquid discharged from the column.

Embodiment 3

[0052] As the anion exchange resin, the same resin as in Example 1 was used, and the column was packed in 50 mL portions at SV=1 hr -1 Make the copper chloride etching waste liquid pass through. The composition of copper chloride etching waste liquid, the concentration of Cu is 8.1%, the concentration of free HCl is less than 1%, the concentration of NaCl is 9.2%, the concentration of Fe is 48ppm, the concentration of Zn is 25ppm, the pH value of the liquid is +1.0, and the temperature of the liquid is controlled At 40±2°C. Figure 4 Indicates the result of analyzing the liquid discharged from the column.

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PUM

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Abstract

The invention is to refine a copper chloride etching waste liquid after etching a copper material by removing impurity metals other than copper which is effective metal with a simple operation. An anionic complex of metal, such as zinc and iron, is known to be removed by bringing the same into contact with a weak anionic exchange resin. The copper which is the effective metal in the copper chloride waste liquid is said to exist as the anionic complex. The inventor found that the anionic complex of the copper in the copper chloride etching waste liquid is substantially not adsorbed even if the complex is brought into contact with the strong or weak basic anionic exchange resin. Accordingly, by bringing the copper chloride etching waste liquid into contact with these anion exchange resins, the anionic complex of the iron or the zinc is adsorbed in the resins and is thereby removed but since the copper remains as it is in the liquid, the copper chloride etching waste liquid can be refined.

Description

technical field [0001] The invention relates to a method for refining copper chloride etching waste liquid after etching copper materials and a copper chloride solution obtained by the refining method. Background technique [0002] The etching method of a copper printed circuit board by a copper chloride etchant is generally widely used in a wide range of fields such as consumer goods and industrial machines. The reaction mechanism of using the etching solution to etch the copper foil of the etched material is shown in the following formula (1). By this reaction, copper chloride (CuCl 2 ) to cuprous chloride (CuCl). [0003] <chemistry num="001"> <chem file="200610066930_cml001.xml" / > < / chemistry> ……(1) [0004] The cuprous chloride produced in this way reduces the etching rate, so, for example, hydrogen peroxide and hydrochloric acid are added to the etchant, and the cuprous chloride is regenerated into cupric chloride by the subsequent regeneration ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/18C01G3/05
CPCY02P10/20C09K13/04C23F1/18C23F1/46
Inventor 松木诗路士
Owner TOAGOSEI CO LTD
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