Nano SiO2 grinding material polishing fluid for electronic glass

A polishing liquid and abrasive technology, which is applied to grinding/polishing equipment, polishing compositions containing abrasives, polishing compositions, etc., can solve the problems of large roughness, high viscosity of polishing liquid, serious adsorption, etc. Foaming and defoaming power, chemical enhancement, surface tension reduction effect

A polishing liquid and abrasive technology, which is applied to grinding/polishing equipment, polishing compositions containing abrasives, polishing compositions, etc., can solve the problems of large roughness, high viscosity of polishing liquid, serious adsorption, etc. Foaming and defoaming power, chemical enhancement, surface tension reduction effect

CN1861724AInactive Publication Date: 2006-11-15HEBEI UNIV OF TECH
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  • Nano SiO2 grinding material polishing fluid for electronic glass
  • Nano SiO2 grinding material polishing fluid for electronic glass

Examples

Experimental program
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Effect test

Embodiment 1

[0046] Preparation of 1425g nano-SiO of electronic glass 2 Abrasive polishing fluid.

[0047] To 1000g 45wt% SiO with 40nm particle size and dispersion degree of ±10.0nm 2 Add 40gJFC, 40gFA / O type I active agent to the hydrosol solution and stir and mix evenly; and add 30g tetrahydroxyethylethylenediamine to the above mixture before polishing and stir evenly; then dilute 15gKOH with 300g deionized water Add it to the above mixed solution and stir evenly; the pH value of the prepared polishing solution is 10.5-13.5.

Embodiment 2

[0049] Preparation of 1355g nano-SiO of electronic glass 2 Abrasive polishing fluid.

[0050] 35wt% SiO to 1000g 50nm particle size 2 Add 45gJFC, 50gFA / O type I active agent to the hydrosol solution and stir and mix evenly; and add 50g triethanolamine to the above mixed solution before polishing and stir evenly; then dilute 10gKOH with 200g deionized water and add to the above mixed solution , stir evenly; the pH value of the prepared polishing solution is 10.5-13.5.

Embodiment 3

[0052] Preparation of 1555g nano-SiO of electronic glass 2 Abrasive polishing fluid.

[0053] 50wt% SiO to 1000g 40nm particle size 2 Add 35gJFC, 60gFA / O type I active agent to the hydrosol solution and stir and mix evenly; and add 40g dihydroxyethylethylenediamine to the above mixture before polishing and stir evenly; then dilute 20gKOH with 400g deionized water Add it to the above mixed solution and stir evenly; the pH value of the prepared polishing solution is 10.5-13.5.

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Abstract

The invention relates to a nanometer SiO2 abradant polishing fluid of the electronic glass which the weight ratio is the abradant and the SiO2 hydrosol 20-45%, the composite alkali 0.5-5.5%, the penetrant 1.0-10%, the surface active agent 1.0-10%, the de-ionized water residuum. The polishing fluid uses the SiO2 hydrosol as the base abradant and adjust the pH to 10.5-13.5 by the composite alkali formed by the KOH and the organic base. So the SiO2 has the good stability.

Description

technical field [0001] The invention relates to a chemical mechanical polishing liquid in the field of precision processing of electronic glass, in particular to a new type of chemical mechanical polishing liquid for global planar precision processing of electronic glass, that is, nano-SiO of electronic glass 2 Abrasive polishing fluid. Background technique [0002] At present, with the rapid development of the information industry, lenses, optical components (lenses, prisms), color TV glass shells, electronic glass for flat panel displays, and disk glass substrates all need to be planarized and precision processed globally. Therefore, the market for electronic glass polishing fluid The demand is increasing year by year. At present, rare earth oxides (mainly composed of CeO 2 ) abrasive polishing liquid to complete the glass polishing process. Micron or even nanometer CeO 2 During the polishing process, the polishing liquid of the abrasive is CeO in the initial stage of ...

Claims

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Application Information

Patent Timeline
15 Nov 2006
Publication
CN1861724A
IPC
C09G1/02; B24B7/24; C09G1/14
Inventors
刘玉岭; 孙鸣