Adhesive sheet for use in cutting

An adhesive sheet and adhesive layer technology, applied in the directions of adhesives, film/sheet adhesives, metal processing, etc., can solve the problems of cutting tape breakage, insufficient breaking strength, insufficient breaking elongation, etc. Achieving the effect of improving operability and yield

Active Publication Date: 2006-12-27
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, even with the above-mentioned dicing tape, when the elongation at break of each layer constituting the base material is insufficient, or the breaking strength is not sufficiently large compared with the tensile modulus of elasticity, dicing tape may be generated during the expansion process. fracture
That is, even the dicing tape of the above structure does not sufficiently prevent breakage during the expanding process.

Method used

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  • Adhesive sheet for use in cutting
  • Adhesive sheet for use in cutting
  • Adhesive sheet for use in cutting

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0074] (Manufacturing of base material film)

[0075] The "trade name: Ceras" manufactured by Mitsubishi Chemical Co., Ltd. was supplied to a T stretch film forming machine (set temperature 230°C) manufactured by Plastics Corporation for film formation, and a base material film with a thickness of 100 μm and a width of 35 cm was produced. . "Trade name: ぜラス" manufactured by Mitsubishi Chemical Corporation is a propylene-based thermoplastic elastomer containing a propylene component and an ethylene propylene rubber component.

[0076] (Evaluation of physical properties of base material film)

[0077] For the obtained base material film, various physical properties of elastic tensile modulus, yield point elongation, breaking elongation, and penetration resistance were evaluated.

[0078] (Manufacture of adhesive sheets for cutting)

[0079] By a conventional method, 90 parts by weight of butyl acrylate and 10 parts by weight of acrylic acid were copolymerized in a toluene solution t...

Embodiment 2

[0082] (Manufacturing of base material film)

[0083] The "brand name: Paramit SA-F" (methacrylate resin) manufactured by Curaray (Company) was calendered and formed into a film (set temperature 170°C) to produce a base film with a thickness of 100 μm and a width of 35 cm.

[0084] (Evaluation of physical properties of base material film)

[0085] In the same manner as in Example 1, the physical properties of the obtained base film were evaluated. The results are shown in Table 1 below.

[0086] (Manufacture of adhesive sheets for cutting)

[0087] The adhesive solution prepared in Example 1 was coated on the corona-treated surface of the substrate film obtained by the above method, and cross-linked by heating at 80°C for 10 minutes to form a 10μm-thick UV-curable adhesive layer . Then, the separator was bonded to the adhesive layer to produce an ultraviolet curable adhesive sheet for dicing.

Embodiment 3

[0089] (Manufacturing of base material film)

[0090] Teijin Chemicals Co., Ltd. "brand name: ヌベラン" (polyester elastomer resin) was supplied to a T stretch film forming machine (set temperature 230°C) manufactured by Plastics Corporation to form a film to produce a thick film. 100μm, 35cm wide substrate film.

[0091] (Evaluation of physical properties of base material film)

[0092] The physical properties of the obtained base material film were evaluated in the same manner as in the first embodiment. The results are shown in Table 1 below.

[0093] (Manufacture of adhesive sheets for cutting)

[0094]The adhesive solution prepared in Example 1 was applied to the corona-treated surface of the substrate film obtained by the above method, and crosslinked and cured at 80°C for 10 minutes to form a 10μm-thick UV-curable adhesive layer . Then, the separator was bonded to the adhesive layer to produce an ultraviolet curable adhesive sheet for dicing.

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Abstract

The present invention provides one kind of adhered sheet for preventing breaking of the cut body during cutting step, the usage of the adhered sheet in cutting and the obtained small cut pieces. The adhered sheet for cutting has basis material and adhesive layer in at least one side of the basis material. The adhered sheet for cutting features the basis material with tensile modulus of elasticity in 50-250 MPa, elongation at break greater than or equal to 200 % and cut-in tolerance greater than or equal to 2.5, with the cut-in tolerance of the basis material being expressed in the formula of cut-in tolerance=(breaking strength)/(tensile strength at 30 % of elongation at break).

Description

Technical field [0001] The present invention relates to an adhesive sheet for dicing, a processing method of a cut body using the adhesive sheet, and a cut body small piece obtained by the processing method. Background technique [0002] In the past, semiconductor wafers made of silicon, gallium, arsenic, etc., were manufactured in a large-diameter state, then cut and separated (dicing) into small element pieces, and then transferred to a fixing process. At this time, the semiconductor wafer is attached and held on the adhesive sheet for dicing (hereinafter referred to as "adhesive sheet"), and each process such as a dicing process, a cleaning process, an expansion process, a picking process, and a fixing process is applied. As the above-mentioned adhesive sheet, an acrylic adhesive or the like is applied to a base material composed of a plastic film, and an adhesive formed by forming an adhesive layer with a thickness of about 1 to 200 μm is generally used. [0003] In the above...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02B26D7/08
CPCC09J2203/326H01L21/6836H01L2221/68327
Inventor 山本昌司桥本浩一新谷寿朗
Owner NITTO DENKO CORP
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