Device for preparing metal ultrafine powder and its method

An ultra-fine powder and ultra-fine powder technology, applied in the field of metallurgy, can solve the problems of narrow powder particle size distribution, large energy consumption, large powder particle size, etc., and achieve the effect of reducing the probability of agglomeration, improving the uniformity and increasing the impulse.

Inactive Publication Date: 2007-02-14
SHAANXI UNIV OF SCI & TECH
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Problems solved by technology

Chinese patent CN200420023889.7 invented a high-pressure gas atomizing nozzle for the preparation of metal powder materials. This invention uses the wall surface of the outer cavity wall of the gas cavity and the wall surface of the inner cavity wall to form a Laval nozzle structure, and uses The high-pressure gas atomizes the metal liquid flow. The feature of this device is that it can be adapted to the powder preparation of high melting point materials. The average particle size of t

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  • Device for preparing metal ultrafine powder and its method
  • Device for preparing metal ultrafine powder and its method
  • Device for preparing metal ultrafine powder and its method

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Embodiment Construction

[0018] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0019] see figure 1 , the present invention comprises atomization tower 10, and the inlet of atomization tower 10 is connected with melt cavity 6 through the composite atomization nozzle that is made of subsonic atomization nozzle 4 and Laval atomization nozzle 2, and the lower end of atomization tower 10 Connected with the vacuum pump 1, a stopper rod 7 is set in the melt chamber 6, and a liquid guide pipe that runs through the subsonic atomization nozzle 4 and the Laval atomization nozzle 2 is also arranged between the melt chamber 6 and the atomization tower 10 8. Subsonic atomizing nozzle 4 and Laval atomizing nozzle 2 are respectively provided with subsonic atomizing nozzle inlet 5 and Laval atomizing nozzle inlet 3, melt chamber 6 and subsonic atomizing nozzle 4 They are also respectively connected to the negative pole of the electric field dispersion ...

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Abstract

The superfine metal powder preparing apparatus and method adopts double-layered composite atomizing nozzle and bipolar atomizing mode. The double-layered composite atomizing nozzle has one upper layer in traditional atomizing structure and one lower layer in Laval nozzle structure and has double-layered metal liquid tearing effect and ultrasonic metal liquid exciting effect. The present invention also adopts doped powder and vortex structure and thus has homogeneous mixing between solid and gas, vortex gas flow impulse and increased gas flow impact force on metal liquid for deep tearing of metal liquid and even small grains. In addition, present invention has increased electric field to make the falling metal powder produce surface charge effect to avoid agglomeration.

Description

technical field [0001] The invention belongs to the fields of metallurgy, materials and engineering, and in particular relates to a device and method for preparing metal ultrafine powder. technical background [0002] The two-flow atomization method of metal liquid flow is a common method for preparing metal powder. At present, using the traditional single-layer two-flow atomization device, the average particle size of the powder that can be produced is 10-30 μm. Chinese patent CN200420023889.7 invented a high-pressure gas atomizing nozzle for the preparation of metal powder materials. This invention uses the wall surface of the outer cavity wall of the gas cavity and the wall surface of the inner cavity wall to form a Laval nozzle structure, and uses The high-pressure gas atomizes the metal liquid flow. The feature of this device is that it can be adapted to the powder preparation of high melting point materials. The average particle size of the prepared powder is above 10...

Claims

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Application Information

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IPC IPC(8): B22F9/08
Inventor 党新安梁荣刘星辉赵小娟杨立军张昌松
Owner SHAANXI UNIV OF SCI & TECH
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