Wiring forming system and method

Abstract

PROBLEM TO BE SOLVED: To improve the productivity of printed circuit boards by each performing highly accurate compensation on various defects generated in an actual manufacturing. ŽSOLUTION: An optical appearance inspection device 13 measures the line width of a wiring pattern using a line width measurement algorithm over the entire region of a printed circuit board after the wiring pattern is formed. Then, the optical appearance inspection device 13 prepares a line width histogram in the unit of a region 22 and further prepares a line width distribution by comparing the prepared line width histogram with the line width histogram of a master image data in the same region 22. Information management system 14 prepares a compensated data based on an average of the line width distribution prepared in a predetermined number of printed circuit boards. A stepper 12 performs a thickening or thinning compensation the line width of a wiring pattern on a design data or an image data for exposure in the unit of the region 22 based on the compensated data. Ž

Description

technical field [0001] The present invention relates to a wiring forming system and method thereof, in particular to a wiring forming system for forming a wiring pattern of a printed substrate. Background technique [0002] The wiring pattern of the printed circuit board is formed through an etching process or the like. In this etching step, for example, there is a problem that the line width of the wiring pattern changes due to thick etching or thin etching. [0003] In order to solve this problem, after the etching process, check whether the wiring pattern meets the design requirements (for example, measure the length), and the worker changes the etching conditions according to the inspection result, or modifies the mask used in the exposure process before the etching process. However, every time a worker checks that a so-called defective substrate is not produced according to the design requirements, it is necessary to recreate the etching conditions or the mask, and the...

AI Technical Summary

Problems solved by technology

[0007] However, in the above-mentioned existing wiring forming system, the size adjustment standard only discloses the case where the above-mentioned inverse problem is obtained by using a known mathematical method, and the specific structure of the size adjustment standard is still unclear.

[0008] In addition, in terms of actual manufacturing, for example, various defects such as deformation of the wiring pattern or uneven etching due to the proximity effect occur, but in the above-mentioned conventional wiring formation system, such defects are not taken into consideration.

In addition, this kind of defect does not occur equally to the entire area of ​​the printed substrate, and the degree of occurrence of this defect is different in each area of ​​the substrate

[0009] In view of the above-mentioned reasons, in the above-mentioned conventional wiring forming system, correction according to the size adjustment standard is difficult in practical use from the viewpoint of actual manufacturing, and it is substantially impossible to realize high-precision correction and improvement of productivity.

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