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Resin composition and its uses in adhesive sheet and copper-cladded plate

A technology of resin composition and adhesive sheet, which is applied in the field of circuit board materials, can solve the problem of low heat resistance, and achieve the effects of improved heat resistance, simple preparation process, and low cost

Active Publication Date: 2007-05-23
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the problem of low heat resistance of existing copper-clad laminate substrate materials, and to provide a resin composition with high heat resistance, which is applied to the production of bonding sheets and copper-clad laminates

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Weigh 40 parts by weight of o-cresol type novolac epoxy resin, 60 parts by weight of brominated difunctional epoxy resin, 30 parts by weight of phenol type Novorak and 0.1 parts by weight of 2-methylimidazole (2-MI), and mix them Add 66 parts by weight of methyl ethyl ketone to prepare a resin solution. Place 8 sheets (400×300) of 7628E-glass fiber cloth and the above resin solution in an oven at 155°C and bake for 5 minutes to form a semi-cured bonding sheet. The gel time (G.T) of the adhesive sheet is 90 seconds (171°C), and the fluidity is 20%. The above 8 adhesive sheets are superimposed and aligned, and one 35 μm electrolytic copper foil is arranged on the top and bottom. In the vacuum press, the temperature is 185℃ and the pressure is 35kg / cm 2 Under the conditions, press for 60 minutes to produce a double-sided copper clad laminate with a thickness of 1.6mm.

Embodiment 2

[0026] Weigh 60 parts by weight of bisphenol A type novolac epoxy resin, 40 parts by weight of brominated difunctional epoxy resin, 50 parts by weight of o-cresol type Novorak and 0.4 parts by weight of 2-phenylimidazole (2-PI), After mixing, add 70 parts by weight of acetone to prepare a resin solution. Place 8 sheets (400×300) of 7628E-glass fiber cloth and the above resin solution in an oven at 155°C and bake for 5 minutes to form a semi-cured bonding sheet. The gel time (G.T) of the adhesive sheet is 90 seconds (171°C), and the fluidity is 20%. The above 8 adhesive sheets are superimposed and aligned, and one 35 μm electrolytic copper foil is arranged on the top and bottom. In the vacuum press, the temperature is 185℃ and the pressure is 35kgf / cm 2 Under the conditions, press for 60 minutes to produce a double-sided copper clad laminate with a thickness of 1.6mm.

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PUM

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Abstract

This invention discloses a resin combination, wherein multi-functional epoxy resin replaces or partly replaces the traditional difunctional brominated epoxy resin, and linear phenolic resin is used to replace dicyandiamide. The specific formula (weight parts) is difunctional brominated epoxy resin 30~70, multi-functional epoxy resin 30~70, linear phenolic resin 30~50, and imidazole accelerator 0.05~0.50. This resin combination makes the copper clad laminate prepared high thermal resistance due to high crosslinking density of resin, which can be applied for lead-free welding.

Description

Technical field [0001] The invention relates to the field of circuit board materials, in particular to a resin composition and its application in the preparation of bonding sheets and copper clad laminates. Background technique [0002] Since the 1990s, the world's electronic information industry, represented by computers and mobile phones, has developed rapidly. The total amount of electronic products in the world is increasing at an annual rate of about 13%. Electronic products have become the world's largest industry today. . [0003] On July 1, 2006, the two directives issued by the European Union ("The Directive on the Prohibition of Certain Hazardous Substances in Electrical and Electronic Products" and the "Directive on Waste Electrical and Electronic Products") were formally implemented, marking that the global electronics industry will enter The era of lead-free soldering. Due to the increase in welding temperature, the requirements for the thermal reliability of copper ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K5/3472B32B5/28B32B15/14C08L61/10
Inventor 辜信实
Owner GUANGDONG SHENGYI SCI TECH