Base-plate structure of semiconductor package direct electric-connection

Abstract

The structure of base plate includes following parts: a load bearing structure with at least a perforative open pore; at least a semiconductor chip with electrical connection pad on surface taken in the load bearing structure; structure of increasing layers for circuits is formed on the chip and the load bearing structure, and conduction structure is formed in the structure of increasing layers in order to connect connection pads electrically; being setup below the load bearing structure partially, a heat sink closes down the said open pore to make the heat sink connect the chip. The structure of base plate integrates semiconductor chip with load bearing piece. The load bearing structure raises heat-sinking capability for electric components. Controlling flattening level raises reliability of subsequent procedure for increasing layers and electrical connection. Advantages are: increasing flexibility of using structure space, and raising electric quality of electronic equipment.

Description

technical field [0001] The present invention relates to a substrate structure directly electrically connected to a semiconductor package, in particular to a semiconductor assembly structure integrating a semiconductor chip and its carrier. Background technique [0002] With the vigorous development of the electronic industry, electronic products tend to be thinner and smaller in form, and gradually enter the research and development direction of high performance, high function and high speed in terms of function. In order to meet the packaging requirements of high integration and miniaturization of semiconductor packages, circuit boards that provide multiple active and passive components and circuit connections have gradually evolved from double-layer boards to multi-layer boards. (Multi-layer board), in a limited space, use the interlayer connection technology to expand the available circuit area on the circuit board to further meet the needs of high-density integrated circ...

AI Technical Summary

Problems solved by technology

Another problem faced by the heat-dissipating semiconductor package of the above-mentioned US patent is that there is no extra space in the package structure to configure passive components, so complete modularization cannot be achieved, and there is no configuration space for connecting other electronic devices. Components, resulting in failure to effectively utilize the performance of the multi-function change of the integrated circuit

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