Attachment feature removal from photomask in extreme ultraviolet lithography application

Abstract

Embodiments of the present disclosure generally provide apparatus and methods for removing an attachment feature utilized to hold a pellicle from a photomask. In one embodiment, an attachment feature removal apparatus for processing a photomask includes an attachment feature puller comprising an actuator, a clamp coupled to the actuator, the clamp adapted to grip an attachment feature, and a coil assembly disposed adjacent to the attachment feature.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims benefit of U.S. Provisional Application Ser. No. 62 / 777,557 filed Dec. 10, 2018, which is incorporated by reference in its entirety.BACKGROUNDField[0002]Embodiments of the present disclosure generally relate to methods and apparatus for an attachment feature removal process from a photomask. Particularly, embodiments of the present disclosure provide methods and apparatus for pellicle stud removal from an attachment feature on a photomask by local induction heating for lithography applications.Description of the Related Art[0003]In the manufacture of integrated circuits (IC), or chips, patterns representing different layers of the chip are created by a chip designer. A series of reusable masks, or photomasks, are created from these patterns in order to transfer the design of each chip layer onto a semiconductor substrate during the manufacturing process. Mask pattern generation systems use precision lasers or electr...

AI Technical Summary

Benefits of technology

The present disclosure provides apparatus and methods for removing an attachment feature used to hold a pellicle from a photomask. The technical effects include reducing difficulties in removing the attachment feature from the photomask, improving the efficiency of the manufacturing process, and preventing damage to the photomask during the removal process.

Problems solved by technology

Thus, any defects in the mask may be transferred to the chip, potentially adversely affecting performance.

Defects that are severe enough may render the mask completely useless.

However, when replacing the pellicle and the attachment feature from the photomask, damage is often caused to the photomask by a mechanical force utilized to pull off the attachment feature.

However, such thermal energy may inevitably damage the film stack and / or structures of the photomask.

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