Paste to be fired for forming circuit board and method for preparing surface-modified silver powder

a technology of surface-modified silver powder and circuit board, which is applied in the direction of manufacturing tools, solventing apparatus, transportation and packaging, etc., can solve the problems of deterioration of the electrical characteristics of the resulting wiring, low heat shrinkage,

Inactive Publication Date: 2001-06-28
MITSUI MINING & SMELTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0008] The inventors of this invention have conducted intensive studies to achieve the foregoing objects, have found that the foregoing objects can efficiently be accomplished by adhering an oxide and / or a double oxide of a specified metal element to the surface of individual metal silver particles to thus convert the silver powder into surface-modified silver powder and have thus completed the present invention.

Problems solved by technology

In addition, firing requires low heat shrinkage.
However, this technique requires the addition of a large amount of inorganic oxide particles to the silver powder and there has been observed such a tendency that this would result in the deterioration of the electrical characteristics of the resulting wiring

Method used

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  • Paste to be fired for forming circuit board and method for preparing surface-modified silver powder

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0035] To 100 parts by mass of silver powder (having an average particle size of about 0.5 .mu.m as determined by the SEM observation), there was added 5 parts by mass of aluminum oxide (having an averaged primary particle size of about 15 mm and a specific surface area of about 100 m.sup.2 / g), followed by sufficient stirring Thus, there was prepared metal silver particles in which fine particulate aluminum oxide was adhered to the surface of the silver particles. Then the silver particles were introduced into Hybridizer (available from Nara Machinery Co., Ltd.) and circulated in the device at a rate of 8000 rpm for 5 minutes to thus give surface-modified silver powder in which fine particulate aluminum oxide was adhered to the surface of the metal silver particles. The fine particulate aluminum oxide was not released from the metal silver particles at all even if the surface-modified silver powder was dispersed in a solvent.

[0036] A pressure of 98 MPa was applied to 0.5 g of the su...

example 2

[0037] The same procedures used in Example 1 were repeated except that fine particulate silicon oxide (having an average primary particle size of about 7 nm and a specific surface area of about 300 m.sup.2 / g) was substituted for the fine particulate aluminum oxide used in Example 1 to give surface-modified silver powder in which the fine particulate silicon oxide was adhered to the surface of the metal silver particles.

[0038] A pressure of 98 MPa was applied to 0.5 g of the surface-modified silver powder to thus mold the powder into a pellet having a diameter of 5 mm and a height of about 5 mm. This pellet was heated to 900.degree.C. using the same device and conditions as in Example 1 to determine the heat shrinkage factor. The results obtained are shown in FIG. 1, while taking the thickness of a green compact prior to heating as a standard. As will be seen from the data shown in FIG. 1, the heat shrinkage factor was found to be only about 3%, even at a high temperature of 850.degr...

example 3

[0039] To 4 liters of pure water in a stainless beaker, there was added 60 g of silver powder (having an average particle size of about 1 (m as determined by the SEM observation), followed by sufficiently stirring to give a slurry, heating the slurry to 60.degree.C. and maintaining the slurry at that temperature. To the slurry, there was added, at a time, an aqueous solution preliminarily prepared by dissolving 17 g of sodium silicate solution (including 35 to 38% of SiO.sub.2, a product of Kanto Kagaku) in 50 ml of pure water and the mixture was sufficiently stirred. Then, the mixture was neutralized with a solution of 18.5 g of concentrated sulfuric acid in 50 mL of pure water and stirred for one hour. Thereafter, the mixture was filtered through a Buchner funnel and fully dried to obtain a cake, which was then dried at 70.degree. C. for 5 hours in a hot air drier. After drying, the cake was passed through a vibrating sieve (200-mesh) to obtain surface-modified silver powder in wh...

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Abstract

A paste to be fired at a temperature lower than melting point of silver for forming a circuit board comprising surface-modified silver powder consisting essentially of metal silver particles having an average particle size of not more than 10 mum and at least one member selected from the group consisting of oxides and double oxides containing at least one metal element selected from the group consisting of those belonging to Groups 2 to 14 of Periodic Table whose atomic number falls within the range of from 12 to 82, which is adhered to the surface of the individual metal silver particles. The surface-modified silver powder has an elevated sintering-initiation temperature and a reduced rate of heat shrinkage due to sintering. Therefore, the surface-modified silver powder is particularly suitable for use in making a circuit board, in particular an LTCC circuit board.

Description

[0001] (a) Field of the Invention[0002] The present invention relates to a paste to be fired for forming a circuit board and methods for preparing surface-modified silver powder. More specifically, the invention relates to a paste to be fired at a temperature lower than the melting point of silver for forming a circuit board, in particular an LTCC (low-temperature colored ceramic) circuit board which comprises surface-modified silver powder consisting essentially of metal silver particles and an oxide and / or a double oxide of a specified metal element adhered to the surface of the metal silver particles, as well as methods for preparing the surface-modified silver powder suitable for use in the paste.[0003] (b) Description of the Prior Art[0004] In recent years, LTCC package is going mainstream in mobile communication terminal and Bluetooth RF circuit that are proceeding toward downsizing and greater packaging density for attaining single chip mounting in the near future. In the LTC...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B22F1/16H05K1/09
CPCB22F1/02H05K1/092B22F1/16
Inventor SASAKI, TAKUYA
Owner MITSUI MINING & SMELTING CO LTD
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