Semiconductor chip and fabrication method thereof

a semiconductor chip and semiconductor technology, applied in semiconductor devices, semiconductor/solid-state device details, electrical devices, etc., can solve the problems of affecting the formation of high-density semiconductor chips on semiconductor wafers
US20050200004A1Inactive Publication Date: 2005-09-15KOIZUMI NAOYUKI
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
KOIZUMI NAOYUKI
Publication Date
2005-09-15
Estimated Expiration
Not applicable · inactive patent

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Abstract

A semiconductor chip and a fabrication method thereof are disclosed. In the fabrication method, isotropic etching and anisotropic etching are performed on a cutting portion of a semiconductor wafer to form grooves in the semiconductor wafer. Through these grooves, the semiconductor wafer can be diced with no use of any dicing blade. In addition, it is possible to form semiconductor chips whose edges and corners are rounded off. According to the fabrication method, fabrication time can be shorten. In addition, it is possible to improve integration and yield of semiconductor chip formation.
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Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention is related to a method of fabricating semiconductor chips by dicing a semiconductor wafer at a predetermined size.

[0003] 2. Description of the Related Art

[0004] In a conventional semiconductor chip fabrication process, a semiconductor wafer, on which a plurality of semiconductor elements are formed, is diced in a dicing process of the fabrication process by shifting a rotationally-driven disk-shaped cutter (dicing blade) of a semiconductor chip fabrication apparatus vertically and horizontally so as to form a large number of semiconductor chips. In general, such semiconductor chips are box-shaped.

[0005] In the above-mentioned conventional semiconductor chip fabrication process, since a dicing blade of a semiconductor chip fabrication apparatus is shifted vertically and horizontally to dice a semiconductor wafer, the semiconductor chip fabrication apparatus has to perform a greater number of ...

Claims

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