Carrier for holding an object to be polished

a technology for polishing objects and carriers, which is applied in the direction of manufacturing tools, contraceptive devices, diagnostic recording/measuring, etc., can solve the problems of carrier falling off from the polishing apparatus, reducing durability over time, and destabilizing the polishing conditions, so as to achieve superior durability and abrasion resistance, and the effect of holding the polishing object with eas

Inactive Publication Date: 2005-09-15
SPEEDFAM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0012] It is therefore an object of the present invention to provide a carrier having high durability and abrasion resistance and causing as few scratches on an object to be polished (hereinafter referred to as “polishing object”) and little heavy metal contamination as possible. Another object of the present invention is to provide a manufacturing method for the carrier. Still another object of the present invention is to provide a double-sided polishing method using the carrier.
[0016] According to the present invention, it is possible to provide a carrier for holding a polishing object with ease, which is superior in durability and abrasion resistance and free of heavy metal contamination. In other words, the carrier of the present invention overcomes all the problems inherent in the conventional carrier.

Problems solved by technology

Hence, the surface is polished to some degree to lower its strength or accuracy of form, resulting in reduction in durability over time.
Also, a gear portion is worn to cause the carrier to come off from the polishing apparatus or to destabilize polishing conditions.
Furthermore, as a purity of a silicon wafer is increased, there has arisen a problem about contamination of the wafer with a trace amount of heavy metal eluting from a metal-made carrier, albeit being negligible in a conventional technique.
A carrier made of, for example, a hard resin or a nonmetal material such as FRP is inferior in the abrasion resistance and durability, and thus falls short of practical applicability.
Meanwhile, a carrier made of a metal material such as steel or stainless steel has a problem about the heavy metal contamination.
As an example thereof, there is proposed a ceramic-coated metal carrier as disclosed in JP 04-026177 A. Although exhibiting an extremely high performance regarding the abrasion resistance, the carrier has a problem in that ceramic particles adhering to the surface drop out of the surface, and the polishing object is scratched thereby.
This offers by no means a solution to the problem in that the polishing object is contaminated with heavy metal, in particular, in polishing the semiconductor wafer.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0024] (Production of DLC Coated Carrier)

[0025] An SUS-made carrier substrate, which had been lapped into the thickness of 550 μm in advance, was coated with DLC into the thickness of 2.5 μm. After the substrate was coated with the DLC up to 1.0 μm under the film formation temperature set to 150° C., the supporting position was shifted to resume the deposition by 1.5 μm.

[0026] (Wear Test and Durability Test)

[0027] The resultant DLC coated carrier was polished under the conditions of Table 1 without holding the polishing object. The diluted abrasive was recycled. A wear rate was determined by calculating a difference between the thicknesses measured before and after the polishing with a micrometer. The durability was examined based on a visual test.

example 2

[0032] The DLC coated carrier produced in Example 1 was polished under the conditions of Table 3 with the carrier holding a 6-inch silicon wafer as a polishing object. In Example 2, the diluted abrasive was not recycled.

COMPARITIVE EXAMPLES 4 TO 6

[0033] The three types of carriers used in Comparative Examples 1 to 3, that is, the SUS-made carrier, the glass-epoxy-resin-made (EG-made) carrier, and the FR-vinylon-made carrier were employed. Similar to Example 2, the carriers were polished under the conditions of Table 3, with the carriers holding the 6-inch silicon wafer. In Comparative Examples 1 to 3, the diluted abrasive was not recycled. Polishing test results of Example 2 and Comparative Examples 4 to 6 are listed in Table 4 below.

TABLE 4ComparativeComparativeComparativeExample 1Example 1Example 2Example 3itemDLC*1SUSEG*2FR-vinylonFe5 or lower455 or lower5 or lowerCu5 or lower85 or lower5 or lowerCr5 or lower135 or lower5 or lower

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Abstract

To provide a diamond-like carbon coated carrier for holding an object to be polished used for double-sided polishing, and a manufacturing method therefor. A carrier for holding an object to be polished according to the present invention has a substrate whose entire surface is coated with diamond-like carbon. A method of the present invention includes coating the entire carrier surface with diamond-like carbon using a surface coating apparatus using plasma CVD.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a carrier for holding an object to be polished (hereinafter referred to as “polishing object”), which is used in a double-sided polishing apparatus that simultaneously polishes both surfaces of the polishing object by holding the polishing object between upper and lower platens covered with abrasive cloth with the platens and the polishing object being in pressure contact with each other, and rotating at least one of the platens and the polishing object, the surface of the carrier being coated with diamond-like carbon, and to a method of manufacturing the carrier, and a method of polishing a polishing object using the carrier. In particular, the invention relates to a diamond-like carbon coated carrier for holding a polishing object used for polishing both surfaces of a silicon wafer, a method of manufacturing the carrier, and a polishing method using the carrier. [0003] 2. Descripti...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B24B37/20B24B37/24B24B37/27B24B37/28H01L21/304
CPCB24B41/067A61F7/007A61H23/0218A61B5/441A61H2201/105A61H2201/5082A61F2007/0086A61F2007/0075A61H2201/1685A61H2201/5007A61F2007/0096A61H2201/5043A61H2201/0157
Inventor YOSHIDA, AKIRASHIMIZU, TOSHIKUNI
Owner SPEEDFAM CO LTD
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