Semiconductor device structure with adhesion-enhanced semiconductor die

a technology of semiconductor dies and dies, which is applied in the direction of semiconductor devices, semiconductor/solid-state device details, electrical equipment, etc., can solve the problems of difficult to obtain a good, solid adhesive bond between the die and the package, the oxide on the silicon die substrate does not lend itself to uniform wetting, and the surface of other problems, to achieve the effect of reducing the delamination potential of the die, reducing the cracking of the package, and improving the adhesion of the di
US20050253243A1Inactive Publication Date: 2005-11-17KING JERROLD L +2
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
KING JERROLD L
Publication Date
2005-11-17
Estimated Expiration
Not applicable · inactive patent

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Abstract

A semiconductor die includes a substantially oxide-free metal layer on at least a portion of a surface thereof. The substantially oxide-free metal may enhance adhesion of a packaging material, or mold compound, to the semiconductor die, prevent the occurrence of voids or presence of moisture between the packaging material and the adjacent surface of the semiconductor die, or otherwise prevent delamination of the packaging material from the adjacent surface of the semiconductor die. The substantially oxide-free metal may be copper, palladium, another substantially oxide-free metal, or a combination of substantially oxide-free metals.
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Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application is a divisional of application Ser. No. 10 / 852,632, filed May 24, 2004, pending, which application is a continuation of application Ser. No. 10 / 309,643, filed Dec. 3, 2002, now U.S. Pat. No. 6,740,545, issued May 25, 2004, which is a continuation of application Ser. No. 09 / 873,581, filed Jun. 4, 2001, now U.S. Pat. No. 6,489,186, issued Dec. 3, 2002, which is a continuation of application Ser. No. 09 / 394,180, filed Sep. 10, 1999, now U.S. Pat. No. 6,316,292, issued Nov. 13, 2001, which is a continuation of application Ser. No. 08 / 963,395, filed Nov. 3, 1997, now U.S. Pat. No. 6,066,514, issued May 23, 2000, which is a divisional of application Ser. No. 08 / 731,793, filed Oct. 18, 1996, now U.S. Pat. No. 5,760,468, issued Jun. 2, 1998, which is a continuation of application Ser. No. 08 / 306,024, filed Sep. 14, 1994, now U.S. Pat. No. 5,583,372, issued Dec. 10, 1996.BACKGROUND OF THE INVENTION

[0002] 1. Field of the Inventi...

Claims

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