Shearing interferometer with dynamic pupil fill

a technology of interferometer and pupil fill, which is applied in the field of photolithographic systems, can solve the problems of shorter wavelength light becoming absorbed by glass lenses and light not reaching silicon wafers
US20050259269A1Inactive Publication Date: 2005-11-24ASML HLDG NV

Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
ASML HLDG NV
Publication Date
2005-11-24
Estimated Expiration
Not applicable · inactive patent

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Abstract

A wavefront measurement system includes a source of electromagnetic radiation. An illumination system delivers the electromagnetic radiation to an object plane. A source of a diffraction pattern is in the object plane. A projection optical system projects the diffraction pattern onto an image plane, which includes a mechanism (e.g., a shearing grating) to introduce the lateral shear. A detector is located optically conjugate with the pupil of the projection optical system, and receives an instant fringe pattern, resulting from the interference between sheared wavefronts, from the image plane. The diffraction pattern is dynamically scanned across a pupil of the projection optical system, and the resulting time-integrated interferogram obtained from the detector is used to measure the wavefront aberration across the entire pupil.
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Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention is generally related to photolithography systems, and more particularly, to measuring wavefront parameters in a photolithographic system.

[0003] 2. Related Art

[0004] Lithography is a process used to create features on the surface of substrates. Such substrates can include those used in the manufacture of flat panel displays, circuit boards, various integrated circuits, and the like. A frequently used substrate for such applications is a semiconductor wafer. One skilled in the relevant art would recognize that the description herein would also apply to other types of substrates.

[0005] During lithography, a wafer, which is disposed on a wafer stage (WS), is exposed to an image projected onto the surface of the wafer by an exposure system located within a lithography system. The exposure system includes a reticle (also called a mask) for projecting the image onto the wafer.

[0006] The reticle is...

Claims

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