Cleaning method and cleaning apparatus for performing the same

a cleaning method and cleaning method technology, applied in the direction of cleaning process and apparatus, cleaning using liquids, cleaning methods, etc., can solve the problems of lowering the yield and productivity of the semiconductor device, batch cleaning methods may not effectively clean the edge and side sections of the semiconductor substrate, and the cleaning method may not effectively remove the impurities sticking to the side and bottom sections of the semiconductor substrate. , to achieve the effect of improving the cleaning effect and improving the cleaning effect with respect to the edge and side sections of the semiconductor
US20060076034A1Inactive Publication Date: 2006-04-13SAMSUNG ELECTRONICS CO LTD
11 Cites 9 Cited by

Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
SAMSUNG ELECTRONICS CO LTD
Publication Date
2006-04-13
Estimated Expiration
Not applicable · inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

A cleaning apparatus includes upper and lower nozzle assemblies supplying a cleaning liquid to edge and bottom sections of a semiconductor substrate. The upper nozzle assembly has a first nozzle supplying the cleaning liquid onto the edge section, and second and third nozzles supplying a nitrogen gas for preventing the cleaning liquid from moving into a center portion of the semiconductor substrate. The cleaning liquid supplied to the edge section flows from the edge section towards a side section of the semiconductor substrate due to the rotation of the semiconductor substrate. An ultrasonic wave generator is provided above the edge section for generating ultrasonic waves. The ultrasonic waves are applied to the cleaning liquid supplied onto the edge and bottom sections, thereby improving the cleaning efficiency. The cleaning apparatus has a guide to guide the cleaning liquid supplied to the edge section toward the side section. The cleaning apparatus may effectively remove impurities from the edge, side and bottom sections of the semiconductor substrate.
Need to check novelty before this filing date? Find Prior Art

Description

RELATED APPLICATIONS

[0001] The present application claims priority from Korean Patent Application No. 2001-74311, filed Nov. 27, 2001, the disclosure of which is hereby incorporated herein by reference in its entirety. FIELD OF THE INVENTION

[0002] The present invention relates to methods and apparatus for cleaning semiconductor substrates and, more particularly, to a method and an apparatus for cleaning an edge section, a side section, and a bottom section of a semiconductor substrate. BACKGROUND OF THE INVENTION

[0003] Generally, semiconductor devices are manufactured by sequentially performing unit processes, such as deposition, photolithography, etching, ion implantation, polishing, cleaning and drying processes, on a semiconductor substrate. Among the above unit processes, the cleaning process is carried out after each unit process has been finished so as to remove the residue remaining on the semiconductor substrate. Recently, as designs tend to require a micro-sized pattern,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More