Phase change material (PCM) compositions for thermal management

US20060124892A1Inactive Publication Date: 2006-06-15EI DU PONT DE NEMOURS & CO

Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
EI DU PONT DE NEMOURS & CO
Publication Date
2006-06-15
Estimated Expiration
Not applicable · inactive patent

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Abstract

The present invention relates to a Phase Change Material (PCM) composition comprising a) from 20 to 80 wt % of a PCM; and b) from 20 to 80 wt % of one or more polymers chosen from the group consisting of b1) Very Low Density Polyethylene (VLDPE) having a density equal or lower than 0.910 g / cm3 measured according to ASTM 792; b2) Ethylene Propylene Rubber (EPR) having a density equal or lower than 0.900 g / cm3 measured according to ASTM 792; b3) Styrene Ethylene Butadiene Styrene (SEBS) copolymers; and b4) Styrene Butadiene Styrene (SBS) copolymers. The PCM composition of the present invention can be used in applications where thermal management is needed, like for example in building, automotive, packaging, garments and footwear.
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Description

FIELD OF INVENTION

[0001] The present invention relates to Phase Change Material (PCM) compositions for the thermal management in different applications like for example in building, automotive, packaging, garments and footwear. The present invention also relates to sheets and molded parts comprising the above PCM composition. BACKGROUND OF THE INVENTION

[0002] There is a general desire in all technical fields to be energy efficient. In the building industry, for example, there is a permanent need to decrease the energy costs related to heating and cooling indoor rooms. The same applies also in the textile industry, for instance for life and personal protection clothing, where the heat excess produced by the wearer must be removed and managed away from his body in order to increase the overall wear comfort.

[0003] PCM materials are highly-productive thermal storage media which are capable of absorbing and releasing high amounts of latent heat during melting and crystallization, resp...

Claims

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