Lead-free glass material for use in sealing and, sealed article and method for sealing using the same
Patent Information
- Authority / Receiving Office
- US · United States
- Patent Type
- Applications(United States)
- Current Assignee / Owner
- YAMATO ELECTRONICS
- Publication Date
- 2007-08-09
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
TECHNICAL FIELD
[0001] The present invention relates to a lead-free glass material for use in sealing, which is used for sealing of an opening or a joint in various kinds of electronic components or electronic products such as an electron tube, a fluorescent display panel, a plasma display panel and a semi conductor package, and to a sealed matter and a sealing method using the lead-free glass material. BACKGROUND ART
[0002] As a general trend, a glass material for use in sealing is used for sealing of various kinds of electronic products which are used with the inside thereof being kept in a high vacuum and for sealing of electronic component packages for preventing entering of corrosive gas or moisture in order to ensure the operation stability. This glass material for use in sealing is made of low-melting glass powder, and a glass continuous layer having glass powder fused thereon is formed by pasting the powder with organic binder solution, coating a sealed portion of an article...