Transfer pick, transfer device, substrate processing apparatus and transfer pick cleaning method

Inactive Publication Date: 2007-10-04
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0024]In accordance with the present invention, an operation of cleaning the pick is easily performed in a short period of time, unlike the conventional arts, in which the cleaning operation must be periodically performed manually. Therefore, it is feasible to effectively maintain the clean state of the contact members of the transfer pick, thus preventing the contact members from being misaligned out of the correct position due to the adhesion of foreign particles to the contact members, or from being dropped during a transfer process. As a result, the proportion of defective products attributable to the reduced a

Problems solved by technology

However, as the substrates are repeatedly transferred, foreign particles or deposits from processed substrates get adhered to the contact members, thereby decreasing the adhesive force of the contact members made of elastomer.
As a result, the accuracy of the transfer operation is reduced, and this results in defective products.
Furthermore, when transferring the substrate by the contact members of the transfer pick having foreign particles adhered to the contact members, the foreign particles are transferred and adhered to the rear surface of the substrate when the transfer pick is brought into close contact with the rear surface of the substrate, thus causing a problem of particle contamination for the substrates.
However, by manually cleaning the contact members, additional

Method used

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  • Transfer pick, transfer device, substrate processing apparatus and transfer pick cleaning method
  • Transfer pick, transfer device, substrate processing apparatus and transfer pick cleaning method
  • Transfer pick, transfer device, substrate processing apparatus and transfer pick cleaning method

Examples

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Example

[0037]Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a schematic horizontal sectional view showing a plasma processing device of a substrate processing apparatus in accordance with an embodiment of the present invention. The plasma process device 1 serves to process, for example, etch a semiconductor wafer W (hereinafter, referred to simply as “wafer”), which is the target substrate, under a specific vacuum level.

[0038]The plasma processing device 1 includes two processing units 2 and 3, and is constructed such that each of the processing units 2 and 3 can independently perform the etching process on the wafer W. Load lock chambers 6 and 7 are coupled to the processing units 2 and 3, respectively, via gate valves G1. A wafer accessing chamber 8, which is a conveyance chamber is provided at the ends of the load lock chambers 6 and 7 that are opposite of the process units 2 and 3. Three connection po...

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PUM

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Abstract

A transfer pick provided at a leading end of a transfer arm of a transfer device for transferring a substrate includes a substrate support surface for supporting the substrate thereon; a plurality of contact members protruded from the substrate support surface to contact with the substrate; and a voltage applying unit for charging the contact members with electricity. Further, the transfer pick has a self-cleaning function of removing particles adhered to the contact members by using repulsive force of an electric charge. In addition, a computer readable memory medium storing a computer executable control program, wherein the control program controls a substrate processing apparatus to perform the transfer pick cleaning method.

Description

FIELD OF THE INVENTION [0001]The present invention relates to a transfer pick used to transfer a substrate, such as a semiconductor substrate, a transfer device having the transfer pick, a substrate processing apparatus having the transfer device, and a transfer pick cleaning method.BACKGROUND OF THE INVENTION[0002]In a typical substrate processing apparatus for performing a process, for example, an etching, a substrate such as a semiconductor wafer, a transfer device (a transfer robot), in which a transfer pick for supporting the substrate is provided on a leading end of a transfer arm, which extends and rotates in specific directions and vertically moves without restriction, is used to transfer the substrate into a processing chamber. Typically, a plurality of contact members, each of which is made of elastomer, is provided on a wafer support surface of the transfer pick. The contact members are brought into contact with the substrate to support the substrate thereon.[0003]The con...

Claims

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Application Information

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IPC IPC(8): G06F7/00
CPCH01L21/67766H01L21/67028
Inventor IKARI, HIROSHI
Owner TOKYO ELECTRON LTD
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