Method of improving surface flame resistnace of substrate

Abstract

A method of improving surface flame resistance of a substrate is provided. A substrate is provided. An atmosphere pressure plasma process is performed on the surface of the substrate to form an inorganic film layer on the surface of the substrate, wherein a process gas of the atmosphere plasma process includes a flame resistance precursor, a carrier gas, and a plasma ignition gas. Particularly, the flame resistance precursor is selected from a siloxane compound, an inorganic alkoxide compound and a combination thereof. The siloxane compound has a formula of Si(OC_nH_2(n+1))₄, n=1˜5, and the inorganic alkoxide compound has a formula of A(OC_mH_2m+1)4, where A represents Sn, Ti, Zr, Ce and m=2.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims the priority benefit of Taiwan application serial no. 95133860, filed Sep. 13, 2006. All disclosure of the Taiwan application is incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a method of improving surface flame resistance of a substrate. More particularly, the present invention relates to a method of improving surface flame resistance of a substrate by using an atmosphere pressure plasma process.[0004]2. Description of Related Art[0005]Since general plastic substrates have poor flame resistance, a flame retardant treatment must be performed on the substrate in order to improve the flame resistance. In current methods of the flame retardant treatment for the plastic substrate, a flame resistance agent containing halogen or nitrogen-phosphate is often used. However, the use of these kinds of chemicals is forbidden by Restriction of Haz...

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Benefits of technology

[0012]The present invention also provide a method of improving surface flame resistance of a substrate. A substrate is provided. A flame resistance precursor is selected according to the substrate, wherein the flame resistance precursor is selected form a siloxane compound, an inorganic alkoxide compound, and a combination thereof. The siloxane compound has a formula of Si(OCnH2(n+1))4, n=1˜5, and the inorganic alkoxide compound has a formula of A(OCmH2m+1)4, where A represents Sn, Ti, Zr, Ce and m=2. Subsequently, a plasma ignition gas is charged into an atmosphere plasma device to clean the surface of the substrate and generate active radicals on the surface of the substrate. Then, a carrier gas is introduced to carry the flame resistance precursor into t

Problems solved by technology

However, the use of these kinds of chemicals is forbidden by Restriction of Hazardous Substance of European Union, so it has became a key issue of research and development that a precursor free of halogen and phosphorous is used as a flame resistant agent.

However, in this method, a twin-screw device is required to stir the mixture uniformly and the process temperature is limited.

However, in this method, an organic s

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