Chip package structure and method of fabricating the same

Abstract

A method of fabricating a chip package structure includes the steps of providing a metal thin plate having a first protrusion part, a second protrusion part and a plurality of third protrusion parts. A chip is then disposed on the metal thin plate and a plurality of bonding wires is formed to electrically connect the chip to the second protrusion part and connect the second protrusion part to the third protrusion parts. Next, an upper encapsulant and a lower encapsulant are formed on an upper surface and a lower surface of the metal thin plate, respectively. Thereafter, an etching mask is formed on the lower surface and exposes the connections among the protrusion parts. Finally, the metal thin plate is etched, such that the first protrusion part, the second protrusion part and the third protrusion parts form a die pad, a bus bar and leads of a lead frame, respectively.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims the priority benefit of P.R.C. application serial no. 200710005145.0, filed Feb. 8, 2007. All disclosure of the P.R.C. application is incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a chip package structure. More particularly, the present invention relates to a chip package structure with a lead frame.[0004]2. Description of Related Art[0005]The production of integrated circuit (IC) devices is mainly divided into three stages including IC design, IC process and IC package.[0006]During the IC process, a chip is manufactured by the steps of wafer fabrication, IC formation, wafer sawing and so on. A wafer has an active surface, which generally refers to the surface including active devices. After the IC inside the wafer is completely formed, a plurality of bonding pads is further disposed on the active surface of the wafer, such that the ...

AI Technical Summary

Benefits of technology

[0011]The present invention is directed to a chip package structure and a method of fabricating the same, so as to reduce the packaging costs arisen from directly employing patterned lead frames in a conventional chip packaging process. Specifically, a metal thin plate is used in the present invention, and a die pad, a bus bar and leads of the lead frame are formed on the metal thin plate through performing an etching step during the packaging process, which is helpful to save the production costs of the chip package structure.

[0012]On the other hand, in the present invention, a lower encapsulant having a concave portion is used as an etching mask in the etching process to replace the conventional photomask. Thereby, the costs of the photomasks are significantly reduced, and the packaging costs are further decreased.

Problems solved by technology

However, masks required in the photolithography process of patterning the lead frame are rather expensive, thereby increasing additional manufacturing costs of the lead frame.

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