Inspection method for semiconductor wafer for reviewing defects

Abstract

An object of the present invention is to provide a suitable method of observing a wafer edge by using an electron microscope. The electron microscope includes a column which can take an image in being tilted, and thus allows a wafer edge to be observed from an oblique direction.

Description

CLAIM OF PRIORITY[0001]The present application claims priority from Japanese application JP 2005-352304 filed on Dec. 6, 2005, the content of which is hereby incorporated by reference into this application.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a method and an apparatus for reviewing defects that have occurred in processes of manufacturing thin film devices such as semiconductor electronic circuit substrates and liquid crystal display substrates, by using a magnification image-pickup apparatus such as a scanning electron microscope.[0004]2. Description of the Related Art[0005]Manufacturing of thin film devices, such as semiconductors, liquid crystal displays, and magnetic heads for hard disks, includes a large number of processes. The number of such manufacturing processes sometimes sums to several hundreds. In a case where defects such as particles and breaks in wiring occur in thin film devices due to unsatisfactory or malf...

AI Technical Summary

Benefits of technology

The present invention provides a method for observing a semiconductor wafer using an electron microscope. The method includes placing the wafer on a sample stage, irradiating the wafer with an electron beam from both normal and tilted directions, capturing images of defects and peeling modes, and displaying the images on a screen. The method allows for easy observation of defects and peeling modes on the wafer edge, which can help improve manufacturing processes and prevent electrical defects. The invention also includes a defect review apparatus with a sample stage, electron beam optical systems, and a display unit for displaying the defects on a map. The apparatus can also capture scanned images of the wafer edge for further analysis.

Problems solved by technology

In this case, sometimes, not only the poor adhesive film tends to be easily peeled off in the process of forming the poor adhesive film, but also films tend to be easily peeled off from the outermost periphery in subsequent processes.

The films thus peeled off are adhered as particles to a processed circuit pattern, causing an electrical defect in some cases.

However, the above-describe document does not disclose a preferable technique using an electron microscope as an observation apparatus.

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