Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Sound Attenuation Building Material And System

a sound attenuation and building material technology, applied in the field of building materials, can solve the problems of poor noise reduction properties, conventional types of shear panels, poor sound attenuators, etc., and achieve the effect of adding strength

Inactive Publication Date: 2009-09-24
ASHTECH IND LLC
View PDF10 Cites 53 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

"The present invention provides a shear panel building material with a microparticle-based core matrix and a rigid material that strengthens it. This material is substantially free from glue and cement. The technical effect of this invention is to provide a stronger and more durable building material that can withstand higher levels of force and has improved insulation properties."

Problems solved by technology

Several problems exist with these conventional types of shear panels.
For example, they are poor sound attenuators, or rather they exhibit poor noise reduction properties.
Another problem with conventional shear panels is that, by themselves, they have poor thermal insulating properties.
This significantly increases costs of building as additional materials and labor is required, while only providing minimum protection.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Sound Attenuation Building Material And System
  • Sound Attenuation Building Material And System
  • Sound Attenuation Building Material And System

Examples

Experimental program
Comparison scheme
Effect test

example 1

Testing of Utility Material of Cenospheres and Sodium Silicate

[0104]A mixture of cenospheres of the form of Extendospheres™ and sodium silicate were combined and allowed to dry and form a fire-resistant insulating material Extendospheres™ of a 300-600 micron diameter size range were combined with sodium silicate solution (O type from PQ corporation) in a 1:1 weight ratio. The wet slurry was poured into a cavity around the turbine and allowed to dry. It formed a hardened mass of Extendospheres™ and sodium silicate. The material was tested with an Ipro-Tek single spool gas turbine. The tests showed that the material has a high insulation capacity, and the ability to withstand heat. The insulation was exposed to temperatures of up to 1200° C. However, it was found that when the material is exposed directly to flames for periods of more than a few minutes, it cracks and blisters and begins to lose physical strength.

example 2

Formation of Mold to Form Wallboard

[0105]In one aspect, the utility material can be wallboard panels. The panels can optionally be formed by exposing an uncured wallboard to microwaves. Such formation, as well as general wallboard formation, can utilize a mold. An example of a mold can be made up of a vinylester resin mold having top and bottom pieces. To form the vinylester resin mold, a wood mold is first constructed. The wood mold can be formed according to the shape and dimensions as illustrated in FIG. 9.

[0106]To form the vinylester resin mold, an outer mold of wood is attached to the base of the wood mold using double sided tape. Any releasable binder or means of attaching can be alternatively used. A resin mixture is formed of 97.5 wt % vinylester resin mixed with 2.5 wt % methyl ethyl ketone peroxide (MEKP) catalyst. Microspheres of the form of Extendospheres and the resin mixture are added in a 1:1 ratio to form a core mixture. The core mixture is mixed well using a stirrin...

example 3

Preparation of Wallboard Using Mold

[0107]As noted, the utility material can be in the form of wallboard panels. The panels can optionally be formed by using the porous vinylester resin mold. First, a wallboard backing paper is cut using a backing paper template as shown in FIG. 10. Although a particular backing paper shape is illustrated, it should be understood that the backing paper can be of any shape or size sufficient to form a segment of wallboard. Facing paper is cut to a rectangle sized just smaller than the greater dimensions of the backing paper. In the present embodiment, the facing paper is cut to an 11.625 inch by 15.25 inch rectangle. The backing paper is folded and placed in the porous mold. A wallboard mixture may be formed using:

700 to 900 g microspheres

1100 to 1300 g sodium silicate solution, such as that sold by “O”

300 to 500 g latex binder

20 to 30 cc foaming agent

[0108]Specifically, the foaming agent is added first to the sodium silicate solution and mixed using ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
sizeaaaaaaaaaa
sizeaaaaaaaaaa
frequenciesaaaaaaaaaa
Login to View More

Abstract

A shear panel building material that includes a first facing membrane, a core matrix disposed on a face of the first facing membrane, and a semi-rigid or rigid material attached to the core matrix. The core matrix can include microspheres having a size of about 200 microns to about 800 microns, sodium silicate, and ethylene vinyl acetate. In one aspect, the shear panel is substantially free from glue and cement.

Description

RELATED APPLICATIONS[0001]This application is a continuation-in-part of U.S. patent application Ser. No. 12 / 077,951, filed on Mar. 21, 2008, which claims the benefit of U.S. Provisional Patent Application No. 60 / 919,509, filed on Mar. 21, 2007, and of U.S. Provisional Patent Application No. 60 / 961,130, filed on Jul. 17, 2007, and of U.S. Provisional Patent Application No. 61 / 002,367, filed on Nov. 7, 2007; this application claims the benefit of U.S. Provisional Patent Application No. 61 / 081,951, filed on Jul. 18, 2008, all of which are each incorporated by reference herein in their entireties.FIELD OF THE INVENTION[0002]The present invention relates generally to building materials, and more particularly to shear panels or shear-type building materials. Accordingly, the present invention involves the fields of chemistry, chemical engineering, manufacturing engineering, construction, and materials science.BACKGROUND OF THE INVENTION AND RELATED ART[0003]Shear panels, as they are gener...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): B32B13/04B32B27/30B32B5/16B32B5/02B32B3/26
CPCC04B28/26Y10T428/2982C04B2111/2092E04B1/90E04B2001/2696E04B2001/7691E04C2/043E04C2/16C04B2111/00612Y10T428/27Y10T428/25Y10T428/2495E04C2/24B32B9/06C04B18/082C04B24/2623C04B38/10C04B20/0036Y10T428/24999Y10T428/249987Y10T442/30Y10T428/249967Y10T428/249971Y10T428/249953Y10T442/10Y02W30/91
Inventor KIPP, MICHAEL D.PUGH, DILWORTH L.RIDGES, MICHAEL D.MCCARVILL, WILLIAM T.
Owner ASHTECH IND LLC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com