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Methods for Wafer Scale Processing of Needle Array Devices

a technology of array devices and wafers, applied in the field of wafer scale processing of needle array devices, can solve the problems of increasing manufacturing costs, slowing down production, and vast potential for implanting electronic devices into patients with direct interface to the neural system

Inactive Publication Date: 2009-12-10
UNIV OF UTAH RES FOUND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0005]Another general embodiment of the present invention sets forth a structure for processing a needle array, comprising a plurality of columns extending vertically from a substrate and situated on the periphery of the substrate, as well as a plurality of needles circumscribe...

Problems solved by technology

The potential for implanting electronic devices into patients with direct interface to the neural system is vast.
Alternative approaches for fabricating similar devices are known, but require a large number of masking steps which also slows down production and increases cost of manufacture.

Method used

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  • Methods for Wafer Scale Processing of Needle Array Devices
  • Methods for Wafer Scale Processing of Needle Array Devices
  • Methods for Wafer Scale Processing of Needle Array Devices

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Embodiment Construction

[0021]In describing embodiments of the present invention, the following terminology will be used.

[0022]The singular forms “a,”“an,” and “the” include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to “a needle” includes reference to one or more of such needles and “etching” includes one or more of such steps.

[0023]As used herein, a plurality of items, structural elements, compositional elements, and / or materials may be presented in a common list for convenience. However, these lists should be construed as though each member of the list is individually identified as a separate and unique member. Thus, no individual member of such list should be construed as a de facto equivalent of any other member of the same list solely based on their presentation in a common group without indications to the contrary.

[0024]Concentrations, amounts, and other numerical data may be expressed or presented herein in a range format. It is to be understood tha...

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Abstract

Methods of fabricating needle arrays on a wafer scale include etching a wafer of columns and needles and coating the same with an electrically insulating material and exposing electrically conductive tips. This process can benefit from using a slow spin speed to distribute resist material across the wafer before etching and using a carrier wafer to support singulated arrays to allow full coverage of upper array surfaces with electrically insulating materials. These processes allow for efficient high volume production of high count microelectrode arrays with a high repeatability and accuracy.

Description

RELATED APPLICATION[0001]This application claims the benefit of U.S. Patent Application No. 61 / 052,509, filed May 12, 2008 which is incorporated herein by reference. This application is also related to U.S. patent application Ser. No. 11 / 807,763, filed May 29, 2007 which is incorporated herein by this reference.BACKGROUND OF THE INVENTION[0002]The potential for implanting electronic devices into patients with direct interface to the neural system is vast. Systems which may enable paraplegics to regain control of their bladder or limbs, provide vision for the blind, or restore vocal cord function are all under development, and promising initial results have been obtained in some experiments.[0003]A key component of some implantable systems is a needle array to enable interfacing of the electronics with a neuron or directly into brain tissue. For example, U.S. Pat. No. 5,215,088 to Normann et al. discloses a three-dimensional electrode device which can be used as a neural or cortical ...

Claims

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Application Information

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IPC IPC(8): C23F1/02
CPCA61B5/04001A61B5/685A61B2562/125A61M2037/0053B81C1/00111A61N1/0543B81B2201/055B81B2207/056A61N1/0531A61B5/24
Inventor BHANDARI, RAJMOHANNEGI, SANDEEPSOLZBACHER, FLORIAN
Owner UNIV OF UTAH RES FOUND
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