The invention discloses a waxy
surface mounting process for reducing damage to the back surface of a
silicon wafer. The process comprises the following steps: firstly, placing a
silicon wafer in automatic
wax pasting equipment, and enabling liquid
wax to form a uniform covering layer on the back surface of the
silicon wafer by accurately controlling the single
wax spraying amount to be 2-5mL and combining a centrifugal wax throwing process of 1500-3500rpm; then, feeding the silicon wafer into a baking unit at 150-350 DEG C, removing the
solvent, solidifying the wax layer, and keeping the temperature of the back surface of the silicon wafer at 70-120 DEG C; and finally, accurately attaching the silicon wafer to a special
ceramic carrier plate with the
surface roughness Ra of 0.2-1.5 microns and the surface temperature of 50-80 DEG C by adopting a 10-50kPa flexible air pressure pressing
system, and carrying out waxy single-side
polishing after the
surface mounting is completed. According to the invention, key process parameters such as wax spraying amount, wax throwing rotating speed, baking temperature, laminating pressure and the like are optimized by the
system, so that the thickness and uniformity of a wax layer are accurately controlled, and the damage rate of the back surface of the silicon wafer in the wax laminating process is obviously reduced, thereby effectively improving the yield of silicon wafer manufacturing.