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One-pack type epoxy resin composition and use thereof

a technology of epoxy resin and composition, applied in the direction of synthetic resin layered products, electromagnetic relay details, solid-state devices, etc., can solve the problems of insufficient heat resistance of cured products, unreacted substances remaining, poor air tightness, etc., to accelerate curing, accelerate curing, and accelerate curing

Inactive Publication Date: 2010-10-07
ORMON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0013]Thus, a sealing agent is required to be capable of being cured at a low temperature of 120° C. or lower, and to improve adhesion between the formed member and the metal terminal so as to maintain airtightness in the relay even under a high-temperature processing condition for a soldering process.
[0031]The one-pack type epoxy resin composition of the present invention, which has a high heat resistance, can enhance adhesion between members e.g., a formed member and a metal terminal of a relay. Further, even after a reflow or flow process using a lead-free solder, the one-pack type epoxy resin composition of the present invention can provide adequate airtight sealing or insulating sealing for the electronic component without decreasing the adhesion.

Problems solved by technology

However, dicyandiamide has the following problems: Since dicyandiamide is a compound having a high melting point, using dicyandiamide solely as the latent curing agent may result in unreacted substances remained, if curing is performed at a temperature of 120° C. or lower.
Further, a cured product obtained has an insufficient heat resistance.
This causes poor airtightness.

Method used

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  • One-pack type epoxy resin composition and use thereof

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0133]A one-pack type epoxy resin composition was prepared by mixing, with respect to 100 parts by weight of bisphenol-A diglycidylether [in Table 1, denoted as “Epoxy Resin (A)”] serving as an epoxy resin, the following curing agents: 10 parts by weight of dicyandiamide [in Table 1, denoted as “Curing Agent (B)”]; 10 parts by weight of an epoxy resin adduct compound (product name: AMICURE (Registered Trademark) MY-24, available from Ajinomoto Fine-Techno Co., Inc.) [in Table 1, denoted as “Curing Agent (C)”]; and 10 parts by weight of 1-cyanoethyl-2-undecylimidazoliumtrimellitate [in Table 1, denoted as “Curing Agent (D)”]. The resultant mixture was further mixed with (i) 1 part by weight of pH 8.0 carbon black (product name: #25, available from Mitsubishi Chemical Corporation) [in Table 1, denoted as “Carbon Black (F)”], (ii) 1 part by weight of an untreated silica (product name: Aerosil 200, available from Nippon Aerosil Co., Ltd.) [in Table 1, denoted as “Inorganic Filler (G)”] ...

examples 2 to 8

, Comparative Examples 1 to 7

[0137]As shown in Table 1, in each of Examples 2 to 4, a curing agent different from that used in Example 1 was used as Curing Agent (D), and an airtightness evaluation test was conducted in the same manner as in Example 1.

[0138]As shown in Table 1, in Example 5, with respect to 50 parts by weight of bisphenol-A diglycidylether, 50 parts by weight of glycerin diglycidylether [in Table 1, denoted as “Wettability Enhancer (E)”] was added. Further, in Example 5, with respect to a total amount (100 parts by weight) of bisphenol-A diglycidylether and glycerin diglycidylether, the same Curing Agents (B) to (D), carbon black, untreated silica, and calcium carbonate as those used in Example 1 were added in the same amounts as those in Example 1, and an airtightness evaluation test was conducted in the same manner as in Example 1.

[0139]As shown in Table 1, in Example 6, pH 3.0 (different from that in Example 1) carbon black (product name: MA11, available from Mit...

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Abstract

Disclosed is a one-pack type epoxy resin composition containing an epoxy resin, dicyandiamide, an epoxy resin adduct compound, and a non-latent imidazole compound. The one-pack type epoxy resin composition is capable of being cured at a low temperature, while having excellent heat resistance and sealing properties. Also disclosed is use of the one-pack type epoxy resin composition.

Description

TECHNICAL FIELD[0001]The present invention relates to a one-pack type epoxy resin composition and use thereof. Particularly, the present invention relates to: a one-pack type epoxy resin composition containing, as its essential components, an epoxy resin, dicyandiamide, an epoxy resin adduct compound, and a non-latent imidazole compound so as to be capable of being cured at a low temperature and have an excellent heat resistance and sealing properties; an electronic component including at least two members adhered to each other by the one-pack type epoxy resin composition; and a sealing method for such an electronic component.BACKGROUND ART[0002]A miniature control relay (hereinafter, referred to as “relay”) is a device for controlling an electric circuit by outputting an electric signal in accordance with conditions such as an electric quantity or a physical quantity. The relay is widely used in: electric home appliances such as televisions, microwave ovens, and air conditioners; m...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C09J163/00C08L63/00C08K9/06B32B27/38B32B37/12
CPCC08G59/4021C08G59/686C08K5/3445C08L63/00H01H9/04H01H50/023Y10T29/49144H01L23/293H01L2924/0002H05K3/303H01L2924/00Y10T428/31515
Inventor ITO, MITSUOFUKUHARA, TOMOHIRONAKAJIMA, SEIJI
Owner ORMON CORP
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