Continuous micro anode guided electroplating device and method thereof

Abstract

A continuous micro anode guided electroplating device and a method thereof are revealed. By real-time image monitoring and capillary action of the micro/nanoscale tube, a three-dimensional microstructure is deposited on a workpiece at the cathode. The deposit is growing smoothly under the real-time image monitoring. Moreover, the workpiece is not immersed in an electrolyte so that contaminations of the workpiece caused by electrolyte are reduced.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of Invention[0002]The present invention relates to a micro anode guided electroplating device and a method thereof, especially to a continuous micro anode guided electroplating device and a method thereof.[0003]2. Description of Related Art[0004]Along with fast development of and great advancement in modern technology, the electronic products are getting compact and light weighted. Similarly, the establishment of micromechanical devices provides more benefits. When the mechanical devices are getting smaller, its resonance frequency increases. Thus high bandwidth accelerometers and pressure gauges are produced. The microelements integrate drivers, limbs, sensors, processors and power supplies so as to move around the world under the microscope and applied to medical field.[0005]Milling, welding and fastening of conventional mechanical devices haven't achieved the space resolution required by the microelements. Integrated circuits have been wi...

AI Technical Summary

Benefits of technology

[0008]Therefore it is a primary object of the present invention to provide a micro anode guided electroplating device and a method thereof in which a workpiece is not soaked in an electrolyte (electroplating solution) so as to reduce the contaminations of the workpiece caused by the electrolyte.

Problems solved by technology

Milling, welding and fastening of conventional mechanical devices haven't achieved the space resolution required by the microelements.

But the uniform thickness structure with low aspect ratio is unable to achieve optimal performance.

However, the deposition rate is not constant so that the micro anode moving in a constant speed will not lead to constant growing of the deposit.

If the micro anode moves too fast, the deposit is gradually reduced in size and finally grows nothing with increasing the distance between the electrodes.

On the contrary, if the micro anode moves too slowly, the deposits contact with the micro anode and a short circuit occurs.

Thus the constant movement of the micro anode is unable to ensure a stable deposit rate.

Thus the deposit is grown in non-uniform size or the electroplating may be interrupted.

Both have affected the quality of electroplated micro components significantly.

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