3D polysilicon diode with low contact resistance and method for forming same
Patent Information
- Authority / Receiving Office
- US · United States
- Current Assignee / Owner
- SANDISK TECH LLC
- Publication Date
- 2011-03-17
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Abstract
Description
BACKGROUND1. FieldThe present invention relates to technology for data storage.2. Description of the Related ArtSemiconductor-based p-i-n diodes are known in the art. These diodes are referred to as p-i-n devices because they include a region that is heavily doped with a p-type conductor (p+ region), an intrinsic region, and a region that is heavily doped with an n-type conductor (n+ region). The intrinsic region is not intentionally doped, but may have a low level of n-type and / or p-type impurities. The p-i-n diode may be formed with materials such as silicon, germanium, silicon germanium, etc. Suitable dopants can be used in the p+ region and the n+ region.Semiconductor-based p-i-n diodes have a variety of uses. One proposed usage is a memory cell. Published U.S. Patent Application 2005 / 0052915 titled, “Nonvolatile Memory Cell without a Dielectric Antifuse having High- and Low-impedance States,” filed on Sep. 29, 2004 describes a p-i-n diode that has at least two resistance states...