Chemical-mechanical polishing tool and method for preheating the same

Inactive Publication Date: 2012-09-27
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0005]A problem to be solved by the present invention is that the conventional method for preheating a chemical-mechanical polishing tool has very high consumption of polishing consumables and thereby increases production cost.
[0028]Compared with the prior art, the technical solution of the present invention has the following advantages.
[0029]The chemical-mechanical polishing tool of the technical solution includes: a polishing pad, a DI water supply channel, a polishing slurry supply channel and a polishing pad conditioner; and the chemical-mechanical polishing tool further includes: a heating apparatus, adapted to heat DI water fed to the DI water supply channel; a temperature sensor, arranged close to the polishing pad to measure a temperature of the polishing pad; and a preheating control system, connected to the temperature sensor, and adapted to control the DI water supply channel to spray the heated DI water to the polishing pad, and when the temperature measured by the temperature sensor is equal to or higher than a predetermined temperature, to close the DI water supply channel, control the polishing slurry supply channel to spray polishing slurry to the polishing pad, and startup the polishing pad conditioner to dress the polishing pad. The chemical-mechanical polishing tool above performs preheating by using the heated DI water and the polishing pad conditioner dressing the polishing pad. Dummy wafers are no longer needed, and consumption of polishing consumables including polishing slurry and the polishing pad is reduced, thereby reducing production cost.
[0030]Furthermore, the chemical-mechanical polishing tool of the technical solution has a nozzle arranged at an end of the DI water supply channel and a baffle arranged at an outlet of the nozzle, so that the spray range for the DI water can be increased, thereby improving preheating performance.
[0031]The method for preheating a chemical-mechanical polishing tool of the technical solution includes: firstly, spraying heated DI water to the polishing pad; and when a temperature of the polishing pad is equal to or higher than a predetermined temperature, stopping spraying the DI water, spraying polishing slurry to the polishing pad and controlling the polishing pad conditioner to dress the polishing pad. The method above firstly heats the polishing pad using the heated DI water, then dresses the polishing pad by the polishing pad conditioner so that the polishing pad quickly reaches its operating condition. Dummy wafers are no longer needed, and consumption of polishing consumables including polishing slurry and the polishing pad is reduced, thereby reducing production cost.

Problems solved by technology

A problem to be solved by the present invention is that the conventional method for preheating a chemical-mechanical polishing tool has very high consumption of polishing consumables and thereby increases production cost.

Method used

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  • Chemical-mechanical polishing tool and method for preheating the same

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Embodiment Construction

[0035]In the prior art, preheating of a chemical-mechanical polishing tool is performed by polishing plural dummy wafers, which has very high consumption of e.g. dummy wafers and polishing slurry, and may reduce the service life of the polishing pad and the polishing pad conditioner, and increase production cost.

[0036]The chemical-mechanical polishing tool of the technical solution includes: a polishing pad, a deionized (DI) water supply channel, a polishing slurry supply channel and a polishing pad conditioner; and the chemical-mechanical polishing tool further includes: a heating apparatus, adapted to heat DI water fed to the DI water supply channel; a temperature sensor, arranged close to the polishing pad to measure a temperature of the polishing pad; and a preheating control system, connected to the temperature sensor, and adapted to control the DI water supply channel to spray the heated DI water to the polishing pad, and when the temperature measured by the temperature sensor...

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Abstract

A chemical-mechanical polishing tool and a method for preheating the same are disclosed. The chemical-mechanical polishing tool includes: a polishing pad, a deionized water supply channel, a polishing slurry supply channel and a polishing pad conditioner; and the chemical-mechanical polishing tool further includes: a heating apparatus, adapted to heat DI water fed to the DI water supply channel; a temperature sensor, arranged close to the polishing pad to measure a temperature of the polishing pad; and a preheating control system, connected to the temperature sensor, and adapted to control the DI water supply channel to spray the heated DI water to the polishing pad, and when the temperature measured by the temperature sensor is equal to or higher than a predetermined temperature, to close the DI water supply channel, control the polishing slurry supply channel to spray polishing slurry to the polishing pad, and startup the polishing pad conditioner to dress the polishing pad. The invention can reduce the consumption of polishing consumables by the chemical-mechanical polishing tool during preheating, thereby reducing production cost.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims priority to Chinese patent application 201010599278.7 titled “CHEMICAL-MECHANICAL POLISHING TOOL AND METHOD FOR PREHEATING THE SAME” and filed with the State Intellectual Property Office on Dec. 21, 2010, the content of which is incorporated herein by reference in is entirety.FIELD OF THE INVENTION[0002]The present invention relates to the field of semiconductor tools, and particularly to a chemical-mechanical polishing tool and a method for preheating the same.BACKGROUND OF THE INVENTION[0003]Chemical-Mechanical Polishing (CMP) is a process of planarization. Since its adoption in the integrated circuit industry in 1990, through continuous practice and improvement, CMP has become a key to reducing the technology node of integrated circuits. Nowadays, CMP is widely used in the planarization of shallow trench isolation (STI), oxides, tungsten plugs, copper metallization, etc. In the process of CMP, every time before t...

Claims

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Application Information

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IPC IPC(8): B24B53/017B24B1/00
CPCB24B37/015B24B53/017B24B37/20Y02P80/30
InventorYANG, TAOZHAO, CHAOLI, JUNFENG
OwnerINST OF MICROELECTRONICS CHINESE ACAD OF SCI