Method For Fabricating Conductive Structures of Substrate
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[0014]The following illustrative embodiments are provided to illustrate the disclosure of the present invention, these and other advantages and effects can be apparent to those in the art after reading this specification.
[0015]It should be noted that all the drawings are not intended to limit the present invention. Various modification and variations can be made without departing from the spirit of the present invention. Further, terms such as “one”, “a” etc. are merely for illustrative purpose and should not be construed to limit the scope of the present invention.
[0016]FIGS. 1A to 1K are schematic cross-sectional views showing a method for fabricating a conductive structure of a substrate according to the present invention.
[0017]Referring to FIGS. 1A and 1B, an insulating substrate 1 having a first surface 10 and a second surface 11 opposite to the first surface 10 is provided, and an insulating adhesive film 2 is formed on the second surface 11 of the insulating substrate 1. The ...
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