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Electro copper plating additive and electro copper plating bath

a technology additive, applied in the field of electro copper plating additive and electro copper plating bath, can solve the problems of poor plating, lack of throwing power, and insufficient gloss, and achieve good gloss and stable plating film

Inactive Publication Date: 2013-12-26
C UYEMURA & CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The invention provides an additive that helps create a uniform plating film with good glossiness, even at high current densities. Additionally, the additive does not deplete when not in use, resulting in a stable and high-quality plating film.

Problems solved by technology

However, these brighteners, which have been conventionally used, do not provide sufficient glossiness and do not have throwing power in a low current density portion of a copper plating film, whereby a rough film is formed.
As a result, when a compound comprising this polymer was used as a brightener for an electrolytic copper plating bath, current distribution was disturbed in a low current density portion and a high current density portion, and therefore uniform electrodeposition was disturbed, and accordingly poor plating, such as occurrence of minute pits and clouding, was caused.

Method used

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  • Electro copper plating additive and electro copper plating bath
  • Electro copper plating additive and electro copper plating bath
  • Electro copper plating additive and electro copper plating bath

Examples

Experimental program
Comparison scheme
Effect test

example 1

Synthesis of Block Polymer

[0036]In an airtight reaction vessel, 600 g (10 mol) of n-propanol and 5.6 g (0.1 mol) of potassium hydroxide were taken, and under a nitrogen gas atmosphere, subjected to an addition reaction with 870 g (15 mol) of propylene oxide at 90 to 130 degrees C. under a pressure of 2 to 5 kg / cm2. After completing the addition reaction with the propylene oxide, the reaction vessel was cooled, and then 660 g (15 mol) of ethylene oxide was added thereto and reacted under the same conditions.

[0037]Next, 50 g of a synthetic adsorbent (Kyoward 600, manufactured by Kyowa Chemical Industry Co., Ltd.) was added to the reaction vessel and agitated at 70 degrees C. for 30 minutes, and then filtered, whereby 2070 g of polyoxyethylene (15) polyoxypropylene (15) propyl ether was obtained.

[0038](Plating Treatment and Plating Film Evaluation)

Copper sulfate (Cu2SO4•5H2O)200g / LConcentrated Sulfuric Acid50g / LNaCl115mg / L

[0039]To a copper sulfate plating solution comprising the above ...

example 2

Synthesis of B lock Polymer

[0042]In an airtight reaction vessel, 580 g (10 mol) of allyl alcohol (2-propen-1-ol) and 5.6 g (0.1 mol) of potassium hydroxide were taken, and under a nitrogen gas atmosphere, subjected to an addition reaction with 870 g (15 mol) of propylene oxide at 90 to 130 degrees C. under a pressure of 2 to 5 kg / cm2. After completing the addition reaction with the propylene oxide, the reaction vessel was cooled, and then 660 g (15 mol) of ethylene oxide was added thereto and reacted under the same conditions.

[0043]Next, 50 g of a synthetic adsorbent (Kyoward 600, manufactured by Kyowa Chemical Industry Co., Ltd.) was added to the reaction vessel and agitated at 70 degrees C. for 30 minutes, and then filtered, whereby 2050 g of polyoxyethylene (15) polyoxypropylene (15) allyl ether was obtained.

[0044](Plating Treatment and Plating Film Evaluation)

[0045]In Example 2, plating treatment was performed using a Hull cell tester with the same manner as in Example 1, except...

example 3

Synthesis of Block Polymer

[0047]In an airtight reaction vessel, 740 g (10 mol) of n-butanol and 5.6 g (0.1 mol) of potassium hydroxide were taken, and under a nitrogen gas atmosphere, subjected to an addition reaction with 580 g (10 mol) of propylene oxide at 90 to 130 degrees C. under a pressure of 2 to 5 kg / cm2. After completing the addition reaction with the propylene oxide, the reaction vessel was cooled, and then 660 g (15 mol) of ethylene oxide was added thereto and reacted under the same conditions.

[0048]Next, 50 g of a synthetic adsorbent (Kyoward 600, manufactured by Kyowa Chemical Industry Co., Ltd.) was added to the reaction vessel and agitated at 70 degrees C. for 30 minutes, and then filtered, whereby 1920 g of polyoxyethylene (15) polyoxypropylene (10) butyl ether was obtained.

[0049](Plating Treatment and Plating Film Evaluation)

[0050]In Example 3, plating treatment was performed using a Hull cell tester with the same manner as in Example 1, except that there was used ...

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Abstract

Provided are an additive for electro copper plating and an electro copper plating bath containing the additive, wherein the additive forms a plating film uniformly in a range of from a low current density portion to a high current density portion and thereby gives good glossiness, and is not consumed at the time of non-usage thereof. In the present invention, an additive for electro copper plating including a block polymer compound expressed by the following general formula (1) is added to an electro copper plating bath. (Here, in the formula, R represents an alkyl group or an alkenyl group having a linear-chain or branched-chain structure and having a carbon number of 1 to 15, m is an integer of from 1 to 30, and n is an integer of from 1 to 40.)

Description

FIELD OF THE INVENTION[0001]The present invention relates to an electro copper plating additive and an electro copper plating bath, particularly relates to an electro copper plating additive suitable as a brightener for a copper sulfate plating bath and an electro copper plating bath containing the additive. The present application asserts priority rights based on JP Patent Application 2011-070667 filed in Japan on Mar. 28, 2011. The total contents of disclosure of the patent application of the senior filing date are to be incorporated by reference into the present application.BACKGROUND OF THE INVENTION[0002]To provide a glossy copper plating film, a brightener has been conventionally added to an electro copper plating bath. As the brightener, for example, organic thio compounds and high molecular organic compounds containing oxygen have been known. (Refer to PTL 1 or 2, for example.) As the organic thio compounds, disulfide compounds, such as NaO3SC3H6S—SC3H6SO3Na, have been widel...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor UCHIDA, HIROKISUGIURA, HIRONORI
Owner C UYEMURA & CO LTD
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