Polishing head and polishing apparatus

Inactive Publication Date: 2014-04-24
SHIN-ETSU HANDOTAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a polishing head that can adjust the surface shape of the rubber film for holding the workpiece and suppress deformation during polishing. The polishing head can polish the entire front surface of the workpiece uniformly regardless of its thickness, and can also be used for final polishing with a thinner template to avoid contact with the polishing pad.

Problems solved by technology

Although, the workpiece holding board 112 is commonly composed of a highly-flat ceramic plate, this polishing head unfortunately has a problem in that variation in thickness of the backing film 113a produces a small pressure distribution, resulting in waviness of the polished front surface of the workpiece and hence lower flatness of the workpiece.

Method used

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  • Polishing head and polishing apparatus
  • Polishing head and polishing apparatus
  • Polishing head and polishing apparatus

Examples

Experimental program
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examples

[0093]Although the present invention will now be more specifically explained based on examples and comparative examples hereinafter, the present invention is not restricted thereto.

examples 1 to 3

[0094]A workpiece was polished with a polishing apparatus of the present invention including the polishing head as illustrated in FIG. 3, and variation in polishing stock removal in a plane of the polished workpiece was evaluated. A silicon single crystal wafer having a diameter of 300 mm and a thickness of 775 μm was used as the workpiece W. The polishing stock removal was calculated by measuring both the thicknesses of the wafer before and after polishing with a flatness measuring instrument in a region excluding a width 2 mm of the outermost peripheral portion as a flatness-guaranteed region and by obtaining differences between the thicknesses before and after polishing in a cross section of the wafer along a diametric direction. A flatness measuring instrument (WaferSight) manufactured by KLA-Tencor was used for measuring the flatness.

[0095]The following polishing heads were prepared: A rigid ring composed of SUS with an outer diameter of 360 mm and an inner diameter of 320 mm w...

examples 4 to 7

[0104]A silicon single crystal wafer was polished under the same conditions as those of Example 1 except that silicon rubber was attached under conditions of a tensile force of 5 N (Example 4), 20 N (Example 5), 35 N (Example 6), and 48 N (Example 7), and the variation in polishing stock removal in a plane of the polished wafer was evaluated as with Example 1.

[0105]FIG. 7A shows the polishing stock removal distribution of the wafer polished in each of Examples 4 to V. FIG. 7B shows the polishing stock removal distribution in the range from 120 mm to 148 mm away from the wafer center as a polishing stock removal distribution of an outer peripheral portion of the wafer. As shown in FIGS. 7A and 7B, it can be understood that the wafer was polished uniformly up to the outer peripheral portion in each of Examples 4 to 7.

[0106]Additionally, as an index representing the polishing stock removal distribution at the outer peripheral portion of the wafer, a difference between a maximum value a...

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Abstract

A polishing head comprising an annular rigid ring; a rubber film attached to the rigid ring by using uniform tensile force; a back plate that is connected to the rigid ring and forms a space portion with the rubber film and the rigid ring; and an annular template that is provided at a peripheral portion of a lower surface portion of the rubber film concentrically with the rigid ring and configured to hold an edge portion of a workpiece, the polishing head holding a back surface of the workpiece on the lower surface portion of the rubber film and sliding a front surface of the workpiece on a polishing pad attached to a turn table to perform polishing. The polishing head and the polishing apparatus can be used for final polishing and uniformly polish the entire front surface regardless of the thickness of the template.

Description

TECHNICAL FIELD[0001]The present invention relates to a polishing head configured to hold a workpiece at the time of polishing a front surface of a workpiece and a polishing apparatus including the polishing head, and more particularly to a polishing head configured to hold a workpiece on a rubber film, and a polishing apparatus including this polishing head.BACKGROUND ART[0002]In recent years, higher integration of semiconductor devices place demand for higher flatness of semiconductor wafers used in such devices. The higher flatness up to near the edge of wafers is also needed to raise the yield of semiconductor chips.[0003]The shape of finished semiconductor wafers depends on a final mirror polishing process. For a 300-mm-diameter silicon wafer, in particular, primary polishing by double-side polishing is performed to meet strict specifications of the flatness, and then secondary polishing and finish polishing by single-side polishing is performed to remove scratches on the surfa...

Claims

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Application Information

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IPC IPC(8): B24B37/32
CPCB24B37/32B24B37/30B24B37/00B24B37/34H01L21/304B24B55/00
Inventor MASUMURA, HISASHI
Owner SHIN-ETSU HANDOTAI CO LTD
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