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Workpiece polishing apparatus

a technology for polishing apparatuses and workpieces, which is applied in the direction of grinding machines, edge grinding machines, manufacturing tools, etc., can solve the problems of difficulty in using apparatuses, and the difficulty of polishing the entire surface of workpieces with very high precision

Inactive Publication Date: 2016-03-24
SHIN-ETSU HANDOTAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patent is about a polishing apparatus that uses a template made of a special resin material with tiny depressions on the surface. This template is placed between the polishing pad and the workpiece, and helps to evenly distribute the polishing agent and stabilize the amount of polishing agent supplied to the gap between the pad and the workpiece. This results in a uniform concentration of abrasive grains on the surface of the workpiece, which makes the surface of the workpiece flat and helps achieve a very smooth surface. Additionally, the resin material used for the template prevents any scratches or winding patterns on the polished workpiece.

Problems solved by technology

It is difficult to polish the entire surface of the workpiece with very high precision.
This apparatus therefore cannot be used when the entire surface of the workpiece is needed to have very high precision of flatness.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0062]A workpiece was polished with the inventive workpiece polishing apparatus to evaluate the flatness of the polished workpiece and the scratch fraction defective.

[0063]The polishing apparatus shown in FIG. 1 was used in example 1. The polishing head shown in FIG. 2 was used in this polishing apparatus. This polishing head was the same as the polishing head shown in FIG. 8 except for the template. The template used herein was produced in the following manner. A bisphenol A based epoxy resin containing a glass filler having a maximum dimension of 2 mm and an adjusted concentration was prepared. This resin was applied by spraying to produce an epoxy resin prepreg containing glass fiber. This prepreg was stacked such that the prepreg was disposed on the side configured to press the polishing pad. The resultant was formed into an annular shape under pressure. The thickness of the template was 750 μm. The surface coverage of the exposed filler on the surface on the side configured to ...

example 2

[0065]A workpiece was polished under the same conditions as example 1 except that the template differed in the following points. The flatness and the fraction defective of the polished workpiece were evaluated. In this example, the template was produced in the following manner. A flat fabric type of glass fiber cloth with a thickness of 0.18 mm and a horizontal and vertical pitch of 0.5 mm was impregnated with a bisphenol A based epoxy resin. The resultant was dried to produce a prepreg for a front surface. This prepreg was stacked such that the prepreg was disposed configured to press the polishing pad. The resultant was formed into an annular shape with a thickness of 760 μm under pressure. The surface configured to press the polishing pad was then polished to expose the glass fiber in a netlike form. The template had a 16% surface coverage of the exposed glass fiber cloth on the surface configured to press the polishing pad.

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PUM

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Abstract

A workpiece polishing apparatus including a polishing pad to polish a workpiece, a polishing agent supplying mechanism to supply a polishing agent, and a polishing head to hold the workpiece such that a back surface of the workpiece is held by a backing pad and an edge of the workpiece is held by an annular template. This apparatus polishes the workpiece by pressing the workpiece and the template against the polishing pad and thereby bringing the workpiece into sliding contact with the polishing pad. The template is made of a resin containing filler or woven fabric and has fine depressions created by filler or woven fabric exposed on the surface on the side that presses the polishing pad. This apparatus can stabilize the polishing rate of the outer circumferential portion of the workpiece and thereby polish the workpiece into a very flat workpiece.

Description

TECHNICAL FIELD[0001]The present invention relates to a workpiece polishing apparatus.BACKGROUND ART[0002]In production of semiconductor wafers such as silicon wafers, a polishing process to improve surface roughness and flatness of a wafer is one of important processes.[0003]As the precision of devices has recently been increased, there is an increasing need for more precisely flattened semiconductor wafers for use in device fabrication. According to this need, chemical mechanical polishing (CMP) is used as a technique to flatten a surface of semiconductor wafers.[0004]Apparatuses for polishing surfaces of a wafer such as a silicon wafer may be classified into two types: a single-side polishing apparatus that polishes one side of a workpiece at a time and a double-side polishing apparatus that polishes both sides simultaneously.[0005]As shown in FIG. 7, for example, a common single-side polishing apparatus is constituted of a turn table 104 to which a polishing pad 107 is attached,...

Claims

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Application Information

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IPC IPC(8): B24B37/20
CPCB24B37/20B24B37/32H01L21/02024
Inventor HASHIMOTO, HIROMASASASAKI, MASANAO
Owner SHIN-ETSU HANDOTAI CO LTD