Microfluidic chip with dielectrophoretic electrodes extending in hydrophilic flow path
a technology of dielectrophoretic electrodes and microfluidic chips, applied in the field of microfluidic chips, can solve the problems of incompatibility with the requirements of microfluidic chip fabrication, manufacturing processes and cost of fabrication, and methods that lack flexibility or operate with limited sample types and flow conditions
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3. SPECIFIC EMBODIMENTS / TECHNICAL IMPLEMENTATION DETAILS
3.1 Example of Fabrication Methods
3.1.1 Using Thick Resist / Dry-Film for Microfluidic Structures
[0134]The substrate can be silicon or glass. Electrodes are patterned on the substrate, e.g., Al (50 nm). Channel patterning is carried out via exposed and developed SU-8 (or dry-film photoresist). The cover can be PDMS, laminate, plastic, etc. The SU-8 is initially hydrophobic, therefore a surface treatment is required, e.g., a 2-3 s cold plasma activation of SU-8 and Si / SiOx chip for achieving hydrophilic surfaces. Such a fabrication provides relatively low resolution and requires quite demanding photolithography steps to eliminate cracks and delamination. A dry-film resist is easier to process and can be initially hydrophilic, i.e. no need for plasma activation. A similar type of dry-film resist can be used to cover the microfluidic structures. Vias (loading pad and air vents) can be on the cover or silicon.
[0135]An example of spec...
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